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Heater member, heater tape, and molded body equipped with heater member

A technology for heaters and molded bodies, applied in the direction of heating elements, heating element materials, ohmic resistance heating parts, etc., can solve the problem of low adhesion of conductive transparent films

Active Publication Date: 2020-04-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent Document 1 reveals that the adhesion of the power supply electrode to the conductive transparent film is low

Method used

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  • Heater member, heater tape, and molded body equipped with heater member
  • Heater member, heater tape, and molded body equipped with heater member
  • Heater member, heater tape, and molded body equipped with heater member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Indium tin oxide (ITO) (tin oxide Concentration: 10% by weight) as a target, the magnetic flux density of the horizontal magnetic field at the surface of the target is 100mT (milliTesla) in the presence of a high magnetic field and an inert gas by DC magnetron sputtering method to form an ITO film. The PEN thin film formed with the ITO film was left in the air at 150° C. for 3 hours to perform annealing treatment. Thereby, ITO is crystallized, and a transparent conductive film is formed. The thickness of the transparent conductive film was 115 nm. The transparent conductive film obtained by the annealing treatment has a polycrystalline structure.

[0095] Next, the PEN film on which the transparent conductive film was formed was cut into strips (short side: 30 mm x long side: 50 mm), and a pair of ends of the transparent conductive film facing each other and extending in the longitudinal direction were exposed with a mask. Cover part of the transparent conductive fi...

Embodiment 2

[0097] A heater member of Example 2 was produced in the same manner as in Example 1 except that a transparent polyimide film (transparent PI, manufactured by Kolon Industries, Inc.) having a thickness of 50 μm was used instead of the PEN film.

Embodiment 3

[0099] Using a polyimide film (PI, manufactured by Toray-Dupont Co., Ltd., product name: Kapton) having a thickness of 75 μm instead of the PEN film, the same operation as in Example 1 was performed to prepare the heater member of Example 3. .

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Abstract

A heater member (1a) is provided with a support body (10), a heating element (20), and at least one pair of power supply electrodes (30). The support body (10) has a sheet-like shape and is made of anorganic polymer. The heating element (20) is in contact with one main surface of the support body (10) and is made of a polycrystalline material containing indium oxide as a main component. The powersupply electrodes (30) are in contact with one main surface of the heating element (20). The heating element (20) has a sheet resistance in the range of 10-150 [omega] / square. The thickness of the heating element (20) is greater than 20 nm and equal to or less than 200 nm. The internal stress of the heating element (20) as measured by X-ray stress measurement is 500 MPa or less.

Description

technical field [0001] The present invention relates to a member for a heater, a tape for a heater, and a molded body with a member for a heater. Background technique [0002] Conventionally, there is known a transparent planar heater that heats the surface of a transparent body to remove fog and frost adhering to the surface. [0003] For example, Patent Document 1 describes a transparent body with a heater. In this transparent body with a heater, a conductive transparent thin film is formed on the surface of a transparent base material. For example, a conductive transparent thin film such as tin oxide or indium oxide is formed on the entire surface of a substrate made of glass, acrylic resin, polyethylene resin, or the like by vacuum deposition or sputtering. Patent Document 1 discloses that the adhesion of the power supply electrode to the conductive transparent film is low. Therefore, a layer made of titanium or titanium alloy is formed on the conductive transparent f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/84H05B3/12H05B3/20
CPCH05B3/84H05B2203/013H05B3/141H05B3/06C23C14/086C23C14/35H05B3/12H05B3/20H05B3/03B32B27/08H05B2203/016H05B3/86H05B2203/017
Inventor 鹤泽俊浩待永广宣林内梨惠堀哲郎佐佐木集
Owner NITTO DENKO CORP
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