Heat-conducting silica gel as well as preparation method and application thereof

A heat-conducting silicon and gel technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve problems such as mixing difficulties, increased viscosity of thermal gel systems, and reduced production efficiency, and achieve improved contact area and anti-settling properties Good, the effect of improving thermal conductivity

Inactive Publication Date: 2020-04-14
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of thixotropic agents such as white carbon black will lead to a rapid increase in the viscosity of the thermally conductive gel system, resulting in difficulty in mixing components A and B and reducing production ef

Method used

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  • Heat-conducting silica gel as well as preparation method and application thereof
  • Heat-conducting silica gel as well as preparation method and application thereof
  • Heat-conducting silica gel as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0073] Example 1-3

[0074] Examples 1-3 each provide a thermally conductive silicone gel, which includes glue A and glue B. The mass ratio of glue A and glue B is 1:1. The specific component types and amounts (parts by weight) are shown in Table 1 below. .

[0075] The preparation method of the above thermal conductive silicone gel is as follows:

[0076] (1) Add the thermally conductive fillers and coupling agents of Glue A and Glue B into a high-speed mixer, stir at 20°C and 1000r / min for 30 minutes, and perform surface activation treatment to obtain a surface-activated thermally conductive filler;

[0077] (2) Add the surface-activated thermally conductive filler obtained in step (1) to the other components in the A glue and the B glue in proportion to the double planetary mixer, and stir for 120 min at 25°C and 25r / min to form A Glue and B glue are vacuum degassed to obtain the thermally conductive silicone gel.

[0078] Table 1

[0079]

Example Embodiment

[0080] Example 4-6

[0081] Examples 4-6 each provide a thermally conductive silicone gel, which includes glue A and glue B. The mass ratio of glue A and glue B is 1:1. The specific component types and amounts (parts by weight) are shown in Table 2 below. .

[0082] The preparation method of the above thermal conductive silicone gel is as follows:

[0083] (1) Add the thermally conductive filler and coupling agent of glue A and glue B into a high-speed mixer, stir at 25°C and 800r / min for 20 minutes, and perform surface activation treatment to obtain a surface-activated thermally conductive filler;

[0084] (2) Add the surface-activated thermally conductive filler obtained in step (1) into the double planetary mixer in proportion with the other components in glue A and glue B respectively, and stir for 100 minutes at 30°C and 30r / min to form A Glue and B glue are vacuum degassed to obtain the thermally conductive silicone gel.

[0085] Table 2

[0086]

Example Embodiment

[0087] Example 7-9

[0088] Examples 7-9 each provide a thermally conductive silicone gel, which includes glue A and glue B. The mass ratio of glue A and glue B is 1:1. The specific component types and amounts (parts by weight) are shown in Table 3 below. .

[0089] The preparation method of the above thermal conductive silicone gel is as follows:

[0090] (1) Add the thermally conductive filler and coupling agent of glue A and glue B into a high-speed mixer, stir at 30°C and 500r / min for 25 minutes, and perform surface activation treatment to obtain a surface-activated thermally conductive filler;

[0091] (2) Add the surface-activated thermally conductive filler obtained in step (1) and other components in glue A and glue B into a double planetary mixer in proportion, and stir for 60 minutes at 35°C and 40r / min to form A Glue and B glue are vacuum degassed to obtain the thermally conductive silicone gel.

[0092] table 3

[0093]

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Abstract

The invention provides heat-conducting silica gel as well as a preparation method and application thereof. The heat-conducting silica gel comprises an adhesive A and an adhesive B according to a massratio of (0.5-1.5): 1; wherein the adhesive A comprises the following components in parts by weight: 100 parts of vinyl silicone oil, 10-30 parts of vinyl MQ silicone resin, 0.5-5 parts of hydrogen-containing silicone oil, 0.1-2 parts of an inhibitor, 300-1500 parts of a heat-conducting filler and 1-10 parts of a coupling agent; the adhesive B is prepared from 100 parts of vinyl silicone oil, 10 to 30 parts of vinyl MQ silicon resin, 1 to 20 parts of a catalyst, 300 to 1500 parts of a heat-conducting filler and 1 to 10 parts of a coupling agent; and the vinyl silicone oil is prepared from vinyl silicone oil with the viscosity of 1 to 2000 cps and vinyl silicone oil with the viscosity of 5000 to 65000cps. The heat-conducting silica gel provided by the invention has good storage stability, and a cured product of the heat-conducting silica gel has relatively high strength and toughness and is easy to integrally peel off.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a heat-conducting silicone gel and its preparation method and application. Background technique [0002] Thermal interface material is a general term for a class of materials that are applied between heat dissipation devices and heat generating devices to reduce the contact thermal resistance between them. Since any surface has a certain roughness, when two surfaces are in contact, there will inevitably be some gaps in them, and the thermal conductivity of air is very small, so it will cause relatively large contact thermal resistance. The use of thermal interface materials can fill this gap, thereby reducing the contact thermal resistance between interfaces and improving heat dissipation performance. [0003] Common thermal interface materials include thermally conductive silicone pads, thermally conductive silicone grease, and thermally conducti...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K9/06C08K3/22C08K3/36C08K3/38C09K5/14
CPCC08K2003/2227C08K2003/385C08K2201/003C08K2201/014C08L83/04C08L2205/025C08L2205/035C09K5/14C08K13/06C08K9/06C08K3/22C08K3/36C08K3/38
Inventor 李明轩邓建波赵志磊高畠博陈洪野
Owner CYBRID TECHNOLOGIES INC
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