Two-component reactive polyurethane hot melt adhesive and preparation method thereof
A polyurethane hot-melt adhesive and reactive technology, applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of inability to meet the bonding needs of electronic products, slow curing speed of hot melt adhesives, and slow curing speed Slow and other problems, to achieve the effect of fast curing speed, high initial bonding strength and high curing strength
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Embodiment 1
[0032] A two-component reactive polyurethane hot melt adhesive, including component A and component B mixed in a weight ratio of 1:1;
[0033] Among them, component A includes polybutylene adipate 40kg, PPG 30kg, 1,4 butanediol 3kg, terpene phenolic resin 10kg, 0.04kg organic bismuth and 40kg MDI;
[0034] Component B includes 40kg of polybutylene adipate, 30kg of PPG, 3kg of 1,4 butanediol, 10kg of terpene phenolic resin, 0.04kg of organic bismuth and 11kg of MDI.
[0035] The preparation method of above-mentioned two-component reactive polyurethane hot-melt adhesive, the steps are as follows:
[0036] (1) Preparation of component A
[0037] Take 40kg of polybutylene adipate, 30kg of PPG, 3kg of 1,4 butanediol and 10kg of terpene phenolic resin, stir and dehydrate at 130°C for 2 hours in a molten state, then cool down to 60°C, add 0.04kg of organic bismuth and 40kg of molten MDI, reacted for 0.5h, then raised the temperature to 80°C, reacted for 1h under vacuum, then raised...
Embodiment 2
[0042] A two-component reactive polyurethane hot melt adhesive, including component A and component B mixed in a weight ratio of 1:1;
[0043] Among them, A component includes phthalic anhydride diethylene glycol 10kg, polybutylene adipate 30kg, PPG 30kg, hydroquinone dihydroxyethyl ether 3kg, terpene phenolic resin 10kg, 0.04kg organic bismuth and 46kg MDI ;
[0044] Component B includes 10kg of phthalic anhydride diethylene glycol, 30kg of polybutylene adipate, 30kg of PPG, 3kg of hydroquinone dihydroxyethyl ether, 10kg of terpene phenolic resin, 0.04kg of organic bismuth and 13kg of MDI.
[0045] The preparation method of above-mentioned two-component reactive polyurethane hot-melt adhesive, the steps are as follows:
[0046] (1) Preparation of component A
[0047]Take 10kg of phthalic anhydride diethylene glycol, 30kg of polybutylene adipate, 30kg of PPG, 3kg of hydroquinone dihydroxyethyl ether, and 10kg of terpene phenolic resin, stir and dehydrate at 140°C for 2 hours...
Embodiment 3
[0052] A two-component reactive polyurethane hot melt adhesive, including component A and component B mixed in a weight ratio of 1:1;
[0053] Among them, component A includes polycaprolactone diol 10kg, polybutylene adipate 30kg, PPG 30kg, hydroquinone dihydroxyethyl ether 3kg, polyacrylate resin 10kg, organic bismuth 0.04kg and 51kg MDI;
[0054] Component B includes 10kg of polycaprolactone diol, 30kg of polybutylene adipate, 3kg of hydroquinone dihydroxyethyl ether, 10kg of polyacrylate resin, 0.04kg of organic bismuth and 17kg of MDI.
[0055] The preparation method of above-mentioned two-component reactive polyurethane hot-melt adhesive, the steps are as follows:
[0056] (1) Preparation of component A
[0057] Take polycaprolactone diol 10kg, polybutylene adipate 30kg, PPG 30kg, hydroquinone dihydroxyethyl ether 3kg, polyacrylate resin 10kg, stir and dehydrate at 140°C for 2 hours , then lower the temperature to 60°C, add 0.04kg organic bismuth and 51kg molten MDI, r...
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