A Phased Array Radar Active Subarray System Based on High Integration and High Reliability

Abstract

The invention discloses a phased array radar active subarray system based on high integration and high reliability. layers and wave control sub-boards; through the use of hybrid microwave circuit technology, the various feeder networks in the phased array radar front are designed in the form of multi-layer printed boards, and the interconnection in the multi-layer boards replaces the interconnections in the traditional front. The external cable connection realizes the change from the lead array to the leadless array, improves the integration of the radar array, thereby reducing the volume and weight of the array, and improving the reliability, maintainability and electromagnetic compatibility of the radar system; At the same time, the cascading technology is adopted to combine the drive components, X-band four-channel TR components, and power sub-components into a whole through the comprehensive network layer. It is not only an independent installation unit, but also an independent debugging unit, which simplifies the interface of each module. Relationship, but also improve productivity, reliability and maintainability.

Description

technical field [0001] The invention relates to the field of radar phased array systems, in particular to a phased array radar active sub-array system based on high integration and high reliability. Background technique [0002] Phased array radar signal transmission network refers to the general term of various feeders for transmitting, distributing and synthesizing radio frequency, wave control and power supply signals between antenna units, TR components, wave control units, power supply systems and other modules in the radar array. The structure is composed of microwave feed network, beam control network and power conversion network; in most phased array radar systems, the signal transmission network occupies a large proportion of the volume and weight of the antenna array, therefore, the development of highly integrated signal The transmission network is an important means to adapt to the development trend of phased array radar integration, miniaturization and light wei...

AI Technical Summary

Problems solved by technology

[0003] With the rapid development of military electronic information technology and the significant changes in the combat mode of modern warfare, phased array radar is mainly developing in the direction of broadband, ultra-wideband and multi-function, that is, in addition to satisfying the radar search, positioning and tracking functions, it also The system is required to have functions such as target recognition, broadband imaging and electronic warfare; ultra-wideband phased array radar can perform multiple functions at the same time, track multiple batches of targets, and have a high radar search and tracking rate, due to the diverse functions of ultra-wideband radar characteristics, and its system structure is more complicated than that of the previous phased array radar. If the traditional planar microwave circuit and discrete beam control and power distribution network are used, the structure of the radar antenna array will be too complicated and the volume will be too large. Resulting in reduced reliability of the radar system

[0004] In the traditional highly integrated phased array radar system, in order to realize the high integration of phased array radar, the traditional method usually uses a multi-layer printed board as the carrier to integrate the array antenna, transceiver components, down converter, correction network, digital The control modules are all integrated on the same multilayer substrate. Although the volume and cost are reduced, its reliability, maintainability, electromagnetic compatibility, etc. are often ignored in this way; in terms of reliability, because the carrier is multilayer The heat dissipation effect of the printed board is very poor, which may cause the power chip of the transmitting part to burn out under the condition of poor heat dissipation; in terms of maintainability, if a certain circuit fails, it is inconvenient to repair, which will lead to the scrapping of the entire product, and then A lot of maintenance costs have been increased; in terms of electromagnetic compatibility, it integrates radio frequency and digital signals on the multilayer printed board at the same time, which will cause mutual interference

[0005] Therefore, prior art still needs to improve and develop

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