Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A method for removing slag from epoxy substrate micron-scale pores

An epoxy substrate, micron-scale technology, applied in the processing of insulating substrates/layers, printed circuits, electrical components, etc., can solve the problems that the treatment liquid cannot be recycled, is not environmentally friendly, the production cost is high, and the process is long, etc., to achieve excellent Effects of thermal stability and chemical stability, short process and good swelling ability

Active Publication Date: 2021-03-02
ZHEJIANG ZHENYOU ELECTRONICS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned process has a long process, high production costs such as heating of each solution, consumption of reducing agents such as residual oxidants, and non-environmental protection problems that the treatment liquid cannot be recycled

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following description is merely exemplary in nature and not intended to limit the disclosure, application or use. The specific implementation of the method for removing slag from epoxy substrates with micron-scale pores according to the present invention will be further described below in conjunction with the accompanying drawings.

[0023] The present invention proposes a method for removing slag from micron-sized pores on an epoxy substrate, comprising the following steps:

[0024] 1. Configure the slag removal solution:

[0025] (1) Weigh the frosting powder with a particle size of D50=0.2mm, add it to DMI (1,3-dimethyl-2-imidazolidinone) solvent, and make it into the first frosting powder with a solid content of 0.5%. slag;

[0026] (2) The second slag removal liquid is prepared from oxalic acid, hydrogen peroxide and ethanol, the pH range is 2, the volume content of hydrogen peroxide is 5%, and the volume content of ethanol is 30%.

[0027] 2. Specific opera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for removing slag from micron-sized pores of an epoxy substrate, which includes a first slag removal liquid and a second slag removal liquid. The specific slag removal step is as follows: the first step: place the epoxy substrate In the slag removal solution (just submerge the epoxy board), ultrasonically assist for 5-10min, ultrasonic frequency 40kHz, power 100-200W, work intermittently for 15s-30s; after the ultrasonic is finished, take out the epoxy substrate and use an elastic scraper or air gun Clean the surface of the board and let it stand for 30 minutes; the second step: put the epoxy substrate treated in the first step in a container with a suction hood, spray the second slag removal solution until the epoxy board is submerged, and ultrasonically assist for 5-10 minutes , Ultrasonic frequency 80kHz‑120kHz, power 100‑200W; Immediately after the end of the ultrasonic wave, take it out, shake it with clean water and dry it. The composition of the slag removal liquid of the invention is simple and easy to obtain, and the price is cheap; the operation procedure is only two steps, and the manufacturing process is short; and the energy consumption is low for normal temperature operation. The first slag-removing liquid can be recycled after being appropriately supplemented with raw materials, and the second slag-removing liquid can also be replenished and recycled after being filtered, which is environmentally friendly and green.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board electroplating, and in particular relates to a method for removing slag from micron-sized pores of an epoxy substrate. Background technique [0002] Drilling is a process of PCB board making, and it is also a very important step. Drilling is to drill the required via holes on the copper clad laminate to provide electrical connection and fix the device. In the printed circuit board (referred to as PCB) processing and manufacturing process, affected by many factors such as materials, structural design, circuit design, pressing process and equipment, the PCB board processed by the pressing process will have a certain degree of deformation, which has a certain impact on drilling. Hole processing has a greater impact, such as drilling is prone to large burrs, hole position deviation, shift, alignment misalignment and other issues. The burrs will affect the post-process processing, and a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0055H05K2203/0769H05K2203/0779H05K2203/0783
Inventor 舒志华詹有根孟永立詹思汗潘青
Owner ZHEJIANG ZHENYOU ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com