Wafer holding apparatus and wafer processing method using the same

The technology of a holding device and a processing method is applied to the wafer holding device and the processing field of the wafer using the wafer holding device, and can solve the problems of inability to remove the undulations and the like

Pending Publication Date: 2020-04-24
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there is a problem that after the gel-like resin is fused with the undulations of the wafer, internal stress is generated during the hardening of the resin, and the undulations of the wafer are slightly deformed and hardened, and the wafer cannot be ground even if it is ground. properly remove the undulations

Method used

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  • Wafer holding apparatus and wafer processing method using the same
  • Wafer holding apparatus and wafer processing method using the same
  • Wafer holding apparatus and wafer processing method using the same

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Embodiment Construction

[0028] Hereinafter, a wafer holding device and a wafer processing method using the wafer holding device according to an embodiment of the present invention will be described with reference to the drawings.

[0029] First, refer to figure 1 with figure 2 A wafer holding device constructed according to the present invention will be described. Such as figure 1 As shown, the wafer holding device generally indicated by reference numeral 2 includes: a holding portion 4 having a holding surface 4 a for holding a wafer; and a frame 6 supporting the holding portion 4 .

[0030] The holding unit 4 is composed of a plurality of advancing and retreating elements. In this embodiment, if figure 2 As shown, each advancing and retreating element is composed of a prismatic piezoelectric element 8, and the front end surface 8a ( figure 2 The upper end surface in the middle) advances and retreats in the length direction. On the base end face of each piezoelectric element 8 ( figure 2 ...

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Abstract

A wafer holding apparatus and a wafer processing method using the same are provided. The wafer holding apparatus can be used for moderate undulation removing of a wafer, and holds a wafer. The wafer holding apparatus includes a holding portion having a holding surface for holding the wafer, the holding portion being composed of a plurality of piezoelectric elements having suction holes selectivelyconnected to a vacuum source, the piezoelectric elements having front end surfaces collected to form the holding surface. The wafer holding apparatus further includes a frame member supporting the holding portion and a control unit controlling a voltage to be applied to each of the piezoelectric elements according to the undulation of the wafer, whereby the wafer is held on the holding surface sothat the holding surface formed by front end surface of the piezoelectric elements corresponds to the undulations of the wafer.

Description

technical field [0001] The present invention relates to a wafer holding device for holding a wafer and a wafer processing method using the wafer holding device. Background technique [0002] A wafer in which functional layers are stacked on the upper surface of the substrate and multiple devices such as ICs and LSIs are formed on the functional layers is divided into individual device chips by a dicing device and a laser processing device, and the divided device chips are used in mobile phones, personal computers, etc. Electronic equipment such as computers. [0003] A wafer is produced by, for example, slicing an ingot of silicon or the like with a wire saw, and then grinds both surfaces to be finished into a flat surface. [0004] In addition, the present applicant obtained a patent for an invention of a method for effectively removing waviness (warpage) of a wafer (see Patent Document 1). [0005] Patent Document 1: Japanese Patent No. 5324212 [0006] However, there i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/6838H01L21/6836H01L21/67288H01L21/67132H01L2221/68327H01L2221/68386B24B7/228H01L21/02013H01L22/12H10N30/202
Inventor 关家一马
Owner DISCO CORP
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