Co-bonded TiZrNbMoTa refractory high-entropy alloy and preparation method thereof

A high-entropy alloy and refractory technology, applied in the field of alloy materials, can solve the problems of composition segregation and difficult processing of high-entropy alloy ingots, and achieve the effects of dense structure, avoiding processing difficulties and fine grains

Active Publication Date: 2020-05-08
FUJIAN UNIV OF TECH
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Problems solved by technology

[0005] The object of the present invention is to provide a Co-bonded TiZrNbMoTa refractory high-entropy alloy and a preparation method thereof, to solve the above-mentioned problems that high-entropy alloys prepared by smelting are prone to component segregation, and high-entropy alloy ingots are difficult to process at room temperature

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  • Co-bonded TiZrNbMoTa refractory high-entropy alloy and preparation method thereof
  • Co-bonded TiZrNbMoTa refractory high-entropy alloy and preparation method thereof
  • Co-bonded TiZrNbMoTa refractory high-entropy alloy and preparation method thereof

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[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] see Figure 1-3 , the present invention provides a technical solution: a Co-bonded TiZrNbMoTa refractory high-entropy alloy, the high-entropy alloy composition includes the following atomic percentage metals: Ti: 10% to 50%, Zr: 10% to 50%, Nb : 10% to 50%, Mo: 10% to 50%, Ta: 10% to 50%.

[0031] Further, as a sintering binder of high-entropy alloy powder, Co powder has good wettability, high toughness and low melting point, and the prepared high-entropy a...

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Abstract

The invention discloses a TiZrNbMoTa refractory high-entropy alloy with Co as a binder and a preparation method thereof, and belongs to the technical field of alloy materials. The preparation method comprises the following steps that high-melting-point metal elements Ti, Zr, Nb, Mo and Ta are adopted as raw materials, and high-entropy alloy powder is prepared through mechanical alloying; and the high-entropy alloy powder and Co powder are evenly mixed and then subjected to spark plasma sintering, and block alloy materials are obtained. The Co-bonded TiZrNbMoTa refractory high-entropy alloy hasthe advantages that the grain size is small, the compactness is high, meanwhile, the components of the alloy are evenly distributed, the performance is good, and therefore the Co-bonded TiZrNbMoTa refractory high-entropy alloy has good application prospects.

Description

technical field [0001] The invention relates to the technical field of alloy materials, in particular to a Co-bonded TiZrNbMoTa refractory high-entropy alloy and a preparation method thereof. Background technique [0002] With the rapid development of science and technology and modern industry, more and more equipment and equipment need to operate for a long time in harsh high-temperature environments, thus putting forward higher requirements for the high-temperature performance of their constituent materials. Superalloys are an important material widely used in aviation, aerospace, petroleum, chemical industry, and ships. However, the service temperature of iron-based superalloys can only reach 750-780°C. For heat-resistant parts used at higher temperatures, nickel-based superalloys and refractory metal-based alloys are used. Refractory metals usually refer to tungsten, molybdenum, niobium, tantalum, vanadium, zirconium, etc., which have excellent properties such as high m...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C30/00C22C1/04B22F9/04B22F3/105
CPCC22C30/00C22C27/02C22C1/045B22F9/04B22F2009/043B22F2003/1051B22F2999/00B22F2201/10Y02P10/25
Inventor 戴品强蔡冰杰朱成龙李战江
Owner FUJIAN UNIV OF TECH
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