Millimeter wave MMIC heat dissipation package based on 3D heterogeneous integration technology
A millimeter-wave, heterogeneous technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problem of inability to take into account the millimeter-wave radio frequency front-end chip millimeter-wave microwave performance and heat conduction, limit the engineering application of millimeter-wave radio frequency front-end chips, and millimeter-wave radio frequency front-end chips. The microwave radio frequency front-end chip has the effect of shortening the interconnect size, ensuring electrical performance, and high yield.
Inactive Publication Date: 2020-05-08
CETC GUOJI SOUTHERN GRP CO LTD
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Abstract
The invention discloses a millimeter wave MMIC heat dissipation package based on a 3D heterogeneous integration technology. The millimeter wave MMIC heat dissipation package comprises a package substrate, a transmission line arranged on the lower surface of the packaging substrate, a TSV via hole arranged in the packaging substrate, a transmission line arranged on the upper surface of the packaging substrate, gold bumps, a millimeter wave GaAs MMIC, a metal PAD arranged on the surface of the GaAs MMIC, a millimeter wave circuit pattern arranged on the surface of the GaAs MMIC, a cavity in theupper surface of the packaging substrate, a high-thermal-conductivity bonding material, a heat dissipation metal block, a plastic packaging material and a BGA solder ball. The millimeter wave MMIC heat dissipation package has the advantages of being small in size, light in weight, low in cost, good in millimeter wave electrical characteristic, excellent in heat dissipation performance and the like, and can be widely applied to a millimeter wave radio frequency front-end system.
Application Domain
Semiconductor/solid-state device detailsSolid-state devices +1
Technology Topic
Radio frequencyThermal transmittance +10
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Property | Measurement | Unit |
Thickness | 0.2 | mm |
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