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Three-layer co-extrusion easy-to-bond solar backboard and preparation method thereof

A solar backplane film, three-layer co-extrusion technology, applied in chemical instruments and methods, layered products, flat products, etc., can solve problems such as complex solar backplane technology, achieve high reflectivity and UV resistance The effect of good junction and high reflectivity

Active Publication Date: 2020-05-12
NINGBO CHANGYANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention develops a three-layer co-extrusion easy-bonding solar backplane film. In order to solve the complicated problem of traditional solar backplane technology, the invention provides a three-layer co-extrusion easy-bonding solar backplane film and its preparation method

Method used

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  • Three-layer co-extrusion easy-to-bond solar backboard and preparation method thereof
  • Three-layer co-extrusion easy-to-bond solar backboard and preparation method thereof
  • Three-layer co-extrusion easy-to-bond solar backboard and preparation method thereof

Examples

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preparation example Construction

[0044] The preparation method of the solar backboard film provided by the invention comprises the following steps:

[0045] (1) Granulation: Mix polyester resin, nano-inorganic fillers, and incompatible resins evenly and carry out twin-screw mixing and granulation to obtain polyester functional masterbatch;

[0046] (2) Cast sheet: a three-layer co-extrusion process is adopted; the polyester resin and the polyester functional masterbatch obtained in step (1) are mixed according to the proportion, and then three extruders are used to carry out ABC three-layer co-extrusion melt plasticization, cast cast sheet;

[0047] (3) Stretching to form a film: longitudinally stretching, transversely stretching, heat-setting, winding and packaging the cast sheet obtained in step (2) to obtain the solar backboard film.

[0048] The polyester resin used in the examples is the PET polyester chip of Sinopec, and the particle size of the nano-inorganic particles is 0.1-8.0 μm.

[0049] The sol...

Embodiment 1

[0054] In the solar backboard film provided by the present invention, the A layer of the backboard film includes: 98% of PET resin, 1% of silicon dioxide, and 1% of anti-UV agent; the B layer includes: 70% of PET resin, 5% of nano-titanium dioxide, PP resin 25%; C layer includes PET resin 94%, ethylene-vinyl acetate copolymer 5%, silicon dioxide 1%. The backboard film is an ABC three-layer co-extrusion structure, and the total thickness of the backboard film is 0.125mm, wherein, the thickness of the A layer accounts for 7% of the total thickness, the thickness of the B layer accounts for 86% of the total thickness, and the C layer The thickness accounts for 7% of the total thickness. The relevant properties are shown in Table 1. The total thickness of the backsheet film is 0.250mm, wherein the thickness of layer A accounts for 7% of the total thickness, the thickness of layer B accounts for 86% of the total thickness, and the thickness of layer C accounts for 7% of the total ...

Embodiment 2

[0056] The solar backboard film provided by the present invention, the A layer of the backboard film includes: 94% of PET resin, 5% of silicon dioxide, and 1% of anti-UV agent; the B layer includes: 50% of PET resin, 50% of PP resin; Layer C includes 91% of PET resin, 8% of ethylene-vinyl acetate copolymer, and 1% of silicon dioxide. The backboard film is an ABC three-layer co-extrusion structure, and the total thickness of the backboard film is 0.125mm, wherein, the thickness of the A layer accounts for 7% of the total thickness, the thickness of the B layer accounts for 86% of the total thickness, and the C layer The thickness accounts for 7% of the total thickness. The relevant properties are shown in Table 1. The total thickness of the backsheet film is 0.250mm, wherein the thickness of layer A accounts for 7% of the total thickness, the thickness of layer B accounts for 86% of the total thickness, and the thickness of layer C accounts for 7% of the total thickness. The ...

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Abstract

The invention relates to the field of films, particularly to an easy-to-bond solar backboard and a preparation method thereof, and provides a three-layer co-extrusion easy-to-bond solar backboard film, which is formed by co-extruding layer A, layer B and layer C and biaxially stretching the three layers, wherein the total thickness of the solar backboard film is 0.125 mm to 0.350 mm, the thicknessof the layer A accounts for 3-15% of the total thickness, the thickness of the layer B accounts for 70-94% of the total thickness, the thickness of the layer C accounts for 3-15% of the total thickness, an anti-UV agent is added to the layer A of the backboard film, and an incompatible resin and nano inorganic particles are added to the layer B.

Description

technical field [0001] The invention relates to the field of thin films, in particular to a three-layer co-extruded solar backboard film and a preparation method thereof. Background technique [0002] The solar backsheet film is located on the back of the solar panel and plays a role in supporting and protecting the solar cells. Since the battery sheet is packaged and fixed by packaging film such as EVA, this requires that the backplane and EVA must have good adhesion. At present, the common backplanes on the market are usually KPK, KPE or KPF multi-layer composite structures. This method involves multiple steps such as lamination, and the process is complicated, resulting in a low pass rate of the product and greatly increasing the production cost. Contents of the invention [0003] The invention develops a three-layer co-extrusion easy-bonding solar backboard film. In order to solve the complicated problem of the traditional solar backboard technology, the invention pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/20B32B27/36B32B7/023B32B33/00H01L31/048H01L31/049H01L31/054B29C48/08B29C48/18B29C69/02B29L7/00
CPCB32B27/36B32B27/20B32B27/08H01L31/0481H01L31/049H01L31/0547B32B2250/244B32B2307/416B32B2307/71Y02E10/52
Inventor 金亚东杨承翰裴旺朱正平
Owner NINGBO CHANGYANG TECH