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Thermosetting adhesive with low fusing temperature

A fusing temperature and thermosetting technology, applied in the application field of low fusing temperature thermosetting adhesives in particle board materials, can solve the problems of high cost of metal modules, high dependence on installation conditions, poor sound insulation effect, etc., to improve the free volume , the effect of chain segment movement to improve and improve toughness

Inactive Publication Date: 2020-05-12
ZISEN ENVIRONMENTAL TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Obviously, the sound insulation effect of traditional sound insulation panels is poor, the cost of metal modules is high, and the dependence on installation conditions is high

Method used

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  • Thermosetting adhesive with low fusing temperature
  • Thermosetting adhesive with low fusing temperature
  • Thermosetting adhesive with low fusing temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Weigh 100 parts of 120-mesh machine-made sand with roundness and sphericity of 0.8, weigh 5 parts of gel solvent, 9 parts of isocyanate, of which 4,5-epoxycyclohexane-1,2- Diglycidyl diformate accounts for 3.5 parts (alicyclic epoxy resin), 1,6-hexanediol diglycidyl ether accounts for 0.1 part (aliphatic epoxy resin), silane accounts for 0.0075 parts, graphene dispersion accounts for 0.0025 parts, isophorone diamine accounted for 1.39 parts.

[0051] First, fully mix the gel solvent in the rubber mixer; then pour the gel solvent into the mixer and mix with the aggregate particles; then put the mixture in the distribution hopper, and the outlet of the distribution hopper is adapted to the width and thickness of the mold ;The mold continuously passes horizontally under the hopper through the transmission mechanism. After the mold passes through the hopper, a layer of particle mixture is evenly arranged in various parts of the mold; then the mold passes through the vibrati...

Embodiment 2

[0054] Compared with Example 1, only the number of isocyanate is changed to 8 parts, and the rest of the materials and manufacturing process are consistent.

Embodiment 3

[0056] Compared with Example 1, only the number of isocyanate is changed to 7, and the rest of the materials and manufacturing process are consistent.

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PUM

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Abstract

The invention discloses a thermosetting adhesive and an application of a low-fusing-temperature particle board in BOX-IN (Brillouin Oxide-Indium Nitride). The thermosetting adhesive with low fusing temperature is prepared from a gel solvent and a resin flexible agent in a certain proportion, wherein the gel solvent is composed of a resin mixed solution, silane and a graphene dispersion solution according to a certain proportion, and the resin mixed solution is composed of organic resin and ammonia substances according to a certain proportion. According to the invention, a proper amount of theflexible agent is added to obtain thermosetting adhesives with different fusing temperatures, so that the particle acoustic board can be subjected to explosion venting and fusing very well during explosion and fire, and enough space and time are provided for fire extinguishing.

Description

technical field [0001] The invention relates to a thermosetting adhesive, in particular to a thermosetting adhesive with a low melting temperature and the application of the low melting temperature thermosetting adhesive in particle board materials. Background technique [0002] The particle board material has good sound absorption performance. In many new particle sound-absorbing panels, thermosetting binders are used as the binder of aggregate particles. Thermosetting binders are cross-linked and solidified under specific conditions. Due to the high cross-link density and difficult movement of chain segments, generally there is no melting point, and its thermal decomposition temperature is above 250°C. In particle sound-absorbing panels, higher temperatures are difficult to destroy the integrity of particle sound-absorbing panels. The inventors have discovered in a large number of innovative technology research and development that the particle sound-absorbing panels made...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04G10K11/162G10K11/165
CPCC08L2205/025C08L2205/03C08L2205/035C09J11/04C09J163/00G10K11/162G10K11/165C08L63/00C08K3/042
Inventor 李航杨宝山李朝阳贾荷香唐云侯强何海林杨鑫
Owner ZISEN ENVIRONMENTAL TECHNOLOGY CO LTD
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