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Epoxy resin composition and flexible copper-clad plate prepared from same

A technology of epoxy resin and flexible copper clad laminate, which is applied in the direction of synthetic resin layered products, coatings, layered products, etc., can solve the problems of poor thermal conductivity and poor thermal conductivity of harmful gases containing halogen and phosphorus, and achieve excellent flexibility, The effect of improving heat dissipation performance

Inactive Publication Date: 2020-05-15
HONGYANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical defects in the prior art that epoxy resin materials for copper clad laminates are prone to produce harmful gases containing halogen and phosphorus and have poor thermal conductivity, the present invention provides an epoxy resin composition for flexible copper clad laminates and the flexible CCL

Method used

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  • Epoxy resin composition and flexible copper-clad plate prepared from same
  • Epoxy resin composition and flexible copper-clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Raw materials are batched according to the following parts by weight

[0025] Bisphenol A epoxy resin 901 11 parts, bisphenol A epoxy resin 188 5 parts, DCEP-EL 6.5 parts, XD1000 4 parts, 1072G 23 parts, 4,4-DDS 4.5 parts, imidazole 0.05 parts boron nitride 10.65 parts , 14 parts of spherical alumina, MCA: 21 parts, EVERNOX-10: 0.1 part, IXE-10: 0.2 part, mix the above raw materials evenly and add an appropriate amount of solvent MEK to obtain a composition with a solid mass percentage of 45%.

Embodiment 2

[0027] Raw materials are batched according to the following parts by weight

[0028] Bisphenol A epoxy resin 901 9 parts, bisphenol A epoxy resin 188 4 parts, DCEP-EL 4 parts, XD1000 5.5 parts, 1072G 23 parts, 4,4-DDS 4 parts, imidazole 0.045 parts spherical alumina 30.59 Parts, MCA: 19.5 parts, EVERNOX-10: 0.115 parts, IXE-10: 0.25 parts, mix the above raw materials evenly and add an appropriate amount of solvent MEK to obtain a composition with a solid mass percentage of 45%.

Embodiment 3

[0030] Raw materials are batched according to the following parts by weight

[0031] Bisphenol A epoxy resin 901 8 parts, bisphenol A epoxy resin 188 4 parts, DCEP-EL 5 parts, XD1000 3 parts, 1072G 19 parts, 4,4-DDS 3.5 parts, imidazole 0.04 parts boron nitride 8.4 parts Spherical alumina 19.75 parts, MCA: 19 parts, EVERNOX-10: 0.11 parts, IXE-10: 0.2 parts, mix the above raw materials evenly and add appropriate amount of solvent MEK to obtain a composition with a solid mass percentage of 45%.

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Abstract

The invention provides an epoxy resin composition and a flexible copper-clad plate prepared from the same. The epoxy resin composition comprises the following components in parts by weight: 5-50 partsof bisphenol A epoxy resin, 5-30 parts of dicyclopentadiene epoxy resin, 5-35 parts of synthetic rubber, 1-30 parts of a nitrogen flame retardant, 1-10 parts of a curing agent, 0.01-2.0 parts of a curing catalyst, 0.01-2.0 parts of an antioxidant, 0.01 to 2.0 parts of an ion trapping agent, and 1 to 80 parts of a heat conduction material. Compared with the prior art, the epoxy resin composition has the beneficial effects that the excellent flexibility of the resin composition is ensured on the premise of effectively reducing the use amount of rubber, and the halogen-free and phosphorus-free resin composition can be obtained through simple mixing in cooperation with the nitrogen-containing flame retardant; the flexible copper-clad plate prepared from the composition has excellent flexibility, heat resistance and process-ability, and the flame retardance reaches the UL94VTM-0 level; and a heat conduction material is added into the flexible copper-clad plate prepared from the composition, so that the heat dissipation performance of the flexible copper-clad plate is improved.

Description

technical field [0001] The invention belongs to the field of preparation of flexible copper-clad laminates, and in particular relates to an epoxy resin composition and a flexible copper-clad laminate prepared therefrom. Background technique [0002] As the integration density of microelectronic devices becomes higher and higher, the heat dissipation requirements of microelectronic devices are also higher and higher. In addition, due to the need for environmental protection, products containing halogen and phosphorus may generate phosphorus-containing waste or halogen-containing waste. harmful gas, endangering the environment. In the process of preparing flexible copper-clad laminates, in order to realize its flame-retardant function, it is necessary to add an epoxy resin functional layer. At present, most functional layers are prone to generate harmful gases containing halogen and phosphorus, and have poor thermal conductivity. Therefore, it is necessary to develop a Enviro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/00C08L21/00C08K13/04C08K3/38C08K7/18C08K5/3492C08J7/04B32B27/28B32B15/20B32B15/08B32B33/00
CPCC08L63/00B32B27/281B32B15/20B32B15/08B32B33/00C08L2201/08C08L2201/02C08L2201/22C08L2205/025C08L2205/035C08K2003/385C08J2379/08C08J2463/02C08J2463/00B32B2255/10B32B2255/26B32B2307/306B32B2307/3065B32B2307/302C08L21/00C08K13/04C08K3/38C08K7/18C08K5/34928
Inventor 龚霈云陈敬通
Owner HONGYANG ELECTRONICS