Production technology of lead frame with locating function

A lead frame and production technology technology, applied in the field of lead frame production technology, can solve the problems of poor corrosion resistance of the lead frame, poor surface cleanliness of the lead frame, unreasonable production process, etc., and achieve corrosion prevention, convenient positioning, and improved anti-corrosion effect

Inactive Publication Date: 2020-05-26
TAIZHOU YOURUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the unreasonable production process in the prior art, the cleanliness of the lead frame surface is poor, oil stains and active agents are easy to remain, which seriously affects the normal use of the lead frame, and the traditional lead frame has poor corrosion resistance , which is not conducive to the long-term use of the lead frame, and a production process of the lead frame with positioning function is proposed

Method used

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  • Production technology of lead frame with locating function
  • Production technology of lead frame with locating function
  • Production technology of lead frame with locating function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] S1. Material preparation: Select copper sheets with moderate thickness, softness and hardness according to requirements. The tensile strength of copper sheets is 411N / mm2, the elongation rate is 16%, the hardness is 130HV, the conductivity is 70S, the burr is 0.01, and the side bending is 0.5;

[0048] S2. Stamping and forming: put the copper sheet into the stamping die for stamping and forming to make a lead frame 1, which is the same as the traditional one, the difference is that four support tubes 101 are added to the four corners of the lead frame 1 to support The diameter of the tube 101 decreases gradually from top to bottom, and the bottom of the support tube 101 is provided with an annular seal;

[0049] S3. Polishing: grinding the surface of the lead frame 1 and each pin with sandpaper and a file to remove burrs;

[0050] S4. Alkali cleaning: put the polished lead frame 1 into an alkaline solution to remove oil, the alkaline solution is 30g / L sodium carbonate s...

Embodiment 2

[0055] A production process of a lead frame 1 with a positioning function, specifically comprising the following steps:

[0056] S1. Material preparation: Select copper sheets with moderate thickness, softness and hardness according to requirements. The tensile strength of copper sheets is 413N / mm2, the elongation rate is 16%, the hardness is 120HV, the conductivity is 70S, the burr is 0.01, and the side bending is 0.5;

[0057] S2. Stamping and forming: put the copper sheet into the stamping die for stamping and forming to make a lead frame 1, which is the same as the traditional one, the difference is that four support tubes 101 are added to the four corners of the lead frame 1 to support The diameter of the tube 101 decreases gradually from top to bottom, and the bottom of the support tube 101 is provided with an annular seal;

[0058] S3. Polishing: grinding the surface of the lead frame 1 and each pin with sandpaper and a file to remove burrs;

[0059] S4. Alkali cleaning:...

Embodiment 3

[0064] The difference from Example 1 is that the lead frame 1 must be sprayed with a corrosion-resistant layer, and the wear-resistant layer is prepared by the following method:

[0065] A production process of a lead frame 1 with a positioning function, specifically comprising the following steps:

[0066] Take the following raw materials and weigh them by weight: 6 parts of titanium dioxide, 4 parts of quartz powder, 2 parts of white pearl powder, 12 parts of talcum powder, 8 parts of polyvinyl alcohol, 10 parts of polyvinyl butyral, 6 parts of polyisocyanate, 8 parts of thickener, 14 parts of binder, 6 parts of defoamer, 80 parts of distilled water;

[0067] A, material preparation: first weigh the above-mentioned raw materials;

[0068] B. Alcohol mixing: first pour distilled water into the blender, then pour polyvinyl alcohol, polyvinyl butyral, polyisocyanate into the blender, stir and mix, control the speed of the blender at 60r / min , the temperature is at 45 degrees ...

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Abstract

The invention discloses a production technology of a lead frame with a locating function. The production technology includes material preparation, punch forming, polishing, alkali washing, acid-base neutralization, drying and detection. Through a series of operation including material preparation, punch forming, polishing, alkali washing, acid-base neutralization, drying and detection, the lead frame with the excellent quality can be manufactured, oil stains and an active agent on the surface of the lead frame are eliminated, the smoothness of the lead frame is improved, the lead frame can beused with long action, through the action of an anticorrosive layer, the lead frame is effectively prevented from being corroded, the anti-corrosion property of the lead frame is improved, and the service life of the lead frame is greatly prolonged.

Description

technical field [0001] The invention relates to the technical field of lead frame production, in particular to a production process of a lead frame with a positioning function. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. Due to the needs of lead frame production and packaging applications, in addition to high strength and high thermal conductivity, the material is also required to have good brazing performance, process performance, etching performance, and oxide film adhesion performance....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 张轩
Owner TAIZHOU YOURUN ELECTRONICS
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