Polishing thinning device and polishing thinning method
A technology of polishing liquid and photoresist, which is applied in grinding devices, grinding/polishing equipment, grinding machine tools, etc., can solve problems such as wafer fragmentation, poor physical properties of InP materials, and fragility, and reduce extrusion stress , Reduce the effect of machining damage
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[0037] The above is the core idea of the present invention. In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention Description, obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0038] An embodiment of the present invention provides a polishing and thinning device for polishing and thinning components such as InP-based wafers, such as figure 1 As shown, it includes a tray 10, a shower head 11 and a magnetic r...
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