Welding sealing system and welding sealing process

A technology of welding sealing and process, applied in metal material coating process, process for producing decorative surface effect, decorative art, etc., can solve the problem of high residual water vapor content, achieve a high degree of automation, meet the needs of mass production, Avoid the effects of increased moisture content

Active Publication Date: 2020-06-19
BEIJING CHENJING ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of high residual water vapor content in the electronic components in the prior art after welding and sealing, thereby providing a method that can effectively reduce the internal water vapor of the sealed components and improve the internal process gas of the sealed components. Purity welded sealing system

Method used

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  • Welding sealing system and welding sealing process
  • Welding sealing system and welding sealing process

Examples

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Embodiment 1

[0074] This embodiment provides a welding sealing system, such as figure 1 As shown, it includes an air filling module 1 , a baking module 2 , a welding module 3 and a transfer module 4 . Wherein, the gas filling module 1 includes a gas supply unit 11 and a condensing unit 12, which are used to provide the baking module 2 and the welding module 3 with process gas in which impurity gases such as water vapor have been removed; the baking module 2 includes a pretreatment unit 21, a baking Unit 22 and the first air extraction unit 23 are used to carry out degassing and baking treatment for the seal to be sealed; the welding module 3 includes a welding unit 31, a discharge unit 32 and a second air extraction unit 33, and the welding module 3 is received by baking The parts to be sealed outputted by the module 2 are welded and sealed under the protection of the process gas atmosphere in the welding module 3 . The transfer module 4 includes a first transfer structure located between...

Embodiment 2

[0087] This embodiment provides a welding and sealing process. The welding and sealing process applies the welding and sealing system in Example 1, which specifically includes the following steps:

[0088] S1, performing gas desorption and baking treatment on the to-be-sealed member in the first reaction zone, and the baking treatment is carried out in a vacuum environment;

[0089] Specifically, in the pretreatment unit 21 located in the first reaction zone, the gas desorption treatment of the parts to be sealed is carried out, and then the parts to be sealed are transferred to the quartz vacuum chamber of the baking unit 22 in the first reaction zone for baking treatment. . During the baking process, the dry pump and the cold pump of the first pumping unit 23 pump air into the quartz vacuum chamber, so that the baked gas is continuously removed, and the vacuum environment of the quartz vacuum chamber is maintained. The temperature of the baking treatment is 140-200°C, and t...

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Abstract

The invention discloses a welding sealing system. The device comprises a gas filling module, a baking module, a welding module and a conveying module, the vapor content of less than 100PPM in the device can be realized, the internal gas pressure of the packaging body can be controlled within +/-500Pa, the purity of the backfill process gas is ensured to be higher than 99.5%, and the sealing requirements of military special processes such as energy storage welding sealing and the like are met. The four modules of the welding sealing system can operate independently and can also work cooperatively, the automation degree is high, and the mass production requirement can be met. The invention further discloses a welding sealing process, and the welding sealing system is applied, so that energystorage welding sealing of low-water-vapor and high-purity process gas can be realized.

Description

technical field [0001] The invention relates to the technical field of welding and packaging, in particular to a welding and sealing system and a welding and sealing process. Background technique [0002] At present, electronic components are widely used in different fields such as communication, medical treatment, information storage, national defense and military affairs. In order to meet different application scenarios, new requirements are put forward for the quality and reliability of electronic components. Among the failure modes of electronic components, the failure of devices caused by excessive internal water vapor content accounts for a relatively high proportion. According to the provisions of GJB597A-96 "General Specification for Semiconductor Integrated Circuits" and GJB5548A-96 "Experimental Methods and Procedures for Microelectronic Devices": the internal water vapor content of microelectronic devices shall not exceed 5000*10 -6 . Water vapor content 5000*1...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00H01L21/50
CPCB81C1/00285H01L21/50
Inventor 陶硕裴志强朱京梁立兴张琳琳廖兴才
Owner BEIJING CHENJING ELECTRONICS
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