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A kind of intermetallic compound based on high-entropy alloy diffusion welding and preparation method thereof

A technology of intermetallic compounds and high-entropy alloys, applied in welding equipment, metal processing equipment, welding/welding/cutting items, etc., can solve problems such as non-wetting welding effect, use of solder joints, poor interface stability, etc., to achieve Solve the oxidation of the welding interface and improve the effect of shear resistance

Active Publication Date: 2021-07-20
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is: aiming at the deficiencies of the prior art, a kind of intermetallic compound based on high-entropy alloy diffusion welding and its preparation method are provided, which effectively solves the problem of using flux and the existence of solder joints during Au80Sn20 / CrMnFeCoNi welding The problem of poor interface stability caused by poor welding effects such as non-wetting greatly improves the interface connection strength of Au80Sn20 / CrMnFeCoNi composite solder joints

Method used

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  • A kind of intermetallic compound based on high-entropy alloy diffusion welding and preparation method thereof
  • A kind of intermetallic compound based on high-entropy alloy diffusion welding and preparation method thereof
  • A kind of intermetallic compound based on high-entropy alloy diffusion welding and preparation method thereof

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Embodiment 1

[0032] The preparation method of the novel intermetallic compound based on high-entropy alloy diffusion welding in this embodiment is carried out in the following steps:

[0033] 1. Preparation of Au80Sn20 eutectic solder: weigh Au and Sn elements according to the mass ratio of 4:1, place them in a vacuum arc melting furnace for arc melting and suction casting, and obtain Au80Sn20 pre-alloyed forming sheets with a thickness of 20 μm;

[0034] 2. Preparation of CrMnFeCoNi high-entropy alloy: Weigh Cr, Mn, Fe, Co, and Ni elements according to the atomic mass ratio of 1:1:1:1:1, and place them in a vacuum arc melting furnace for melting into ingots to obtain high-entropy alloys. Entropy Alloy Ingot;

[0035] 3. Solder joint structure design: first cut the Au80Sn20 eutectic alloy into 3×3mm slices, then cut the high-entropy alloy ingot into 8mm×8mm×1mm slices, and polish it into a mirror surface, then put the Au80Sn20 alloy on On the high-entropy alloy mirror surface, they are pl...

Embodiment 2

[0039] The preparation method of the novel intermetallic compound based on high-entropy alloy diffusion welding in this embodiment is carried out in the following steps:

[0040] 1. Preparation of Au80Sn20 eutectic solder: weigh Au and Sn elements according to the mass ratio of 4:1, place them in a vacuum arc melting furnace for arc melting and suction casting, and obtain Au80Sn20 pre-alloyed forming sheets with a thickness of 20 μm;

[0041] 2. Preparation of CrMnFeCoNi high-entropy alloy: Weigh Cr, Mn, Fe, Co, and Ni elements according to the atomic mass ratio of 1:1:1:1:1, and place them in a vacuum arc melting furnace for melting into ingots to obtain high-entropy alloys. Entropy Alloy Ingot;

[0042] 3. Solder joint structure design: first cut the Au80Sn20 eutectic alloy into 3×3mm slices, then cut the high-entropy alloy ingot into 8mm×8mm×1mm slices, and polish it into a mirror surface, then put the Au80Sn20 alloy on On the high-entropy alloy mirror surface, they are pl...

Embodiment 3

[0046] The preparation method of the novel intermetallic compound based on high-entropy alloy diffusion welding in this embodiment is carried out in the following steps:

[0047] 1. Preparation of Au80Sn20 eutectic solder: weigh Au and Sn elements according to the mass ratio of 4:1, place them in a vacuum arc melting furnace for arc melting and suction casting, and obtain Au80Sn20 pre-alloyed forming sheets with a thickness of 20 μm;

[0048] 2. Preparation of CrMnFeCoNi high-entropy alloy: Weigh Cr, Mn, Fe, Co, and Ni elements according to the atomic mass ratio of 1:1:1:1:1, and place them in a vacuum arc melting furnace for melting into ingots to obtain high-entropy alloys. Entropy Alloy Ingot;

[0049] 3. Solder joint structure design: first cut the Au80Sn20 eutectic alloy into 3×3mm slices, then cut the high-entropy alloy ingot into 8mm×8mm×1mm slices, and polish it into a mirror surface, then put the Au80Sn20 alloy on On the high-entropy alloy mirror surface, they are pl...

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Abstract

The invention discloses an intermetallic compound based on high-entropy alloy diffusion welding and a preparation method thereof; it belongs to the technical field of composite material preparation. The present invention forms a new type of intermetallic compound layer on the surface of the high-entropy alloy substrate through a one-step vacuum diffusion bonding process, and the obtained intermetallic compound includes nano-scale Co 3 Fe 7 phase; the nanoscale Co 3 Fe 7 The particles are dispersed in the Au 5 Sn, the Au 5 Sn fragments into individual quasi-nanoparticles that form fine-grained reinforcement within the intermetallic compound layer. The Au80Sn20 / CrMnFeCoNi composite solder joint interface obtained by the invention has no defects, good shear performance and significantly improved interface stability, and can be used for the preparation of industrial-grade diffusion connection of high-entropy alloys. The invention solves the problem of the existing welding substrate for electronic packaging, and explores the organization, structure and performance of the intermetallic compound at the industrial-grade welding interface of the high-entropy alloy, and provides necessary conditions for its industrial application.

Description

technical field [0001] The invention relates to an intermetallic compound based on high-entropy alloy diffusion welding and a preparation method thereof, belonging to the technical field of composite material preparation. Background technique [0002] A high-entropy alloy is defined as a new type of alloy containing at least five metal atoms, each with an atomic mass between 5 and 35%. It always forms a simple crystalline structure. Chinese Taiwanese scholar Yeh. et al. first began to study CrMnFeCoNi high-entropy alloys. This typical alloy is also called "cantor" alloy. Research reports that this alloy has high hardness, high strength, high wear resistance, oxidation resistance and Excellent properties such as corrosion resistance. Therefore, it is considered as a next-generation structural material. [0003] Joining of high-entropy alloys plays an important role in their industrial-grade applications, such as welding, assembling into desired shapes. At present, researc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K20/14B23K20/22B23K20/24B22D18/06C22C1/02C22C5/02C22C19/07C22C30/00B23K103/08
CPCB22D18/06B23K20/14B23K20/22B23K20/24B23K2103/08C22C1/02C22C5/02C22C19/07C22C30/00
Inventor 刘文胜唐思危柳萧马运柱
Owner CENT SOUTH UNIV