Temporarily bonded body composed of ceramic resin complex and metal plate and method for manufacturing same, and transporter comprising said temporarily bonded body and delivery method using same
A temporary bonding, ceramic resin technology, applied in the field of transport bodies, can solve the problems of high thermal conductivity and low thermal conductivity, and achieve the effect of strong impact ability and high reliability
Pending Publication Date: 2020-06-30
DENKA CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] However, in the invention of the above-mentioned Patent Document 1, since there is a thermosetting resin layer with low thermal conductivity between the particles of the ceramic powder, the highest thermal conductivity is only 15W / (m·K). limit
Method used
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Examples
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Effect test
Embodiment 1
[0108] In Example 1, cyanate A was used as the thermosetting resin, the curing rate of the resin was set to 15%, ethanol was used as the solvent, copper plate was used as the metal plate, and the applied pressure was set to 2 MPa. The tensile shear adhesive strength of the obtained temporary bonded body was 0.30 MPa.
Embodiment 2
[0110] The difference from Example 1 is that the applied pressure was set to 0.1 MPa. The tensile shear adhesive strength of the obtained temporary bonded body was 0.27 MPa.
Embodiment 3
[0112] The difference from Example 1 is that the applied pressure was set to 250 MPa. The tensile shear adhesive strength of the obtained temporary bonded body was 0.32 MPa.
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Abstract
The purpose of the present invention is to make the breakage or deterioration of a poor-strength ceramic resin complex unlikely to occur. A ceramic-metal temporality bonded body comprising a ceramic resin complex and a metal plate that is temporality bonded to at least one surface of the ceramic resin complex, wherein the ceramic resin complex is produced by impregnating a non-oxide ceramic sintered body with a heat-curable resin composition having a cyanate group so that the non-oxide ceramic sintered body can have a curing rate of 5.0 to 70% inclusive as calculated with a differential scanning calorimeter, and the shear bond strength between the ceramic resin complex and the metal plate is 0.1 to 1.0 MPa inclusive.
Description
technical field [0001] The present invention relates to a temporary bonded body of a ceramic resin composite and a metal plate using a thermosetting resin composition and a method for producing the same, and further relates to a transport body including the temporary bonded body and a method for transporting the same. Background technique [0002] In recent years, with the increase in performance and miniaturization of electronic equipment represented by mobile phones, LED lighting devices, and automotive power modules, mounting technologies are rapidly advancing in semiconductor devices, printed wiring board mounting, and device mounting. . Therefore, the heat generation density inside the electronic equipment is increasing year by year, how to efficiently dissipate the heat generated during use and the reliability of the electronic equipment have become important issues. Therefore, high thermal conductivity and reliability are required for ceramic resin composite sheets u...
Claims
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IPC IPC(8): C04B41/83B32B15/095B32B18/00H01L23/373H05K3/38
CPCH05K3/38B32B18/00B32B15/095C04B41/83H01L23/373C04B35/515C04B37/021C04B2237/407C04B2237/361C04B35/63456B32B9/005B32B9/041B32B7/12B32B2260/046B32B37/10B32B2264/107B32B2307/306B32B2307/542B32B2315/02
Inventor 南方仁孝山县利贵井之上纱绪梨吉松亮古贺龙士
Owner DENKA CO LTD