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Anti-oxidation solder alloy for tin-plated copper strip coating and preparation method of anti-oxidation solder alloy

A technology of tinned copper strip and solder alloy, applied in welding equipment, metal processing equipment, welding/cutting medium/material, etc., can solve the problem of affecting the welding effect of tinned copper strip, uneven surface thickness of coating, damage to product life, etc. problems, to achieve the effect of simple formula and process, uniform distribution of alloy on the surface of the coating, and improved reliability

Inactive Publication Date: 2020-07-10
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the domestic tinned copper strip industry mainly uses pure tin solder. During the hot-dip tinning process, pure tin solder is likely to cause uneven thickness of the coating surface. When the coating surface is in a high temperature or humid environment, surface oxidation and copper strip hair black, resulting in continuous corrosion on the surface of the coating, affecting the soldering effect of the tin-plated copper strip in subsequent production, and ultimately damaging the product life

Method used

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  • Anti-oxidation solder alloy for tin-plated copper strip coating and preparation method of anti-oxidation solder alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A tin-plated copper strip coating anti-oxidation solder alloy is prepared according to the following steps:

[0024] Step 1, prepare the basic material of component (1): tin (Sn, purity 99.99%) 92.4Kg, heat to 360°C to form high-temperature liquid tin;

[0025] Step 2, prepare component (2) reinforcing material: bismuth (Bi) 5.5Kg, copper (Cu) 0.9Kg, antimony (Sb) 0.8Kg, and add to the high-temperature liquid tin in step 1 in turn, and keep stirring until completely melted , to obtain the master alloy;

[0026] Step 3: Slowly lower the temperature of the master alloy in step 2 to 220°C, and at the same time remove the oxide slag, oxide ash and other sundries generated on the surface of the master alloy, and then add the antioxidant material of component (3): Gallium (Ga) 0.2Kg Add 0.2Kg of germanium (Ge) into the master alloy, and keep stirring until it is completely melted to obtain tin-plated copper strip coating anti-oxidation solder alloy.

Embodiment 2

[0028] A tin-plated copper strip coating anti-oxidation solder alloy is prepared according to the following steps:

[0029] Step 1, prepare component (1) base material: tin (Sn, purity 99.99%) 93.3Kg, heat to 360 ℃ to form high-temperature liquid tin;

[0030] Step 2, prepare component (2) reinforcing material: bismuth (Bi) 5.0Kg, copper (Cu) 0.5Kg, antimony (Sb) 0.9Kg, and add to the high-temperature liquid tin in step 1 in turn, and keep stirring until completely melted , to obtain the master alloy;

[0031] Step 3: Slowly lower the temperature of the master alloy in step 2 to 220°C, and at the same time remove the oxide slag, oxide ash and other sundries generated on the surface of the master alloy, then add component (3) anti-oxidation material: gallium (Ga) 0.1Kg, Add germanium (Ge) 0.2Kg into the master alloy, and keep stirring until it is completely melted to obtain tin-plated copper strip coating anti-oxidation solder alloy.

Embodiment 3

[0033] A tin-plated copper strip coating anti-oxidation solder alloy is prepared according to the following steps:

[0034] Step 1, prepare component (1) base material: tin (Sn, purity 99.99%) 93.9Kg, heat to 360°C to form high-temperature liquid tin;

[0035] Step 2, prepare component (2) reinforcing material: bismuth (Bi) 4.0Kg, copper (Cu) 0.7Kg, antimony (Sb) 0.9Kg, and add to the high-temperature liquid tin in step 1 in turn, and keep stirring until completely melted , to obtain the master alloy;

[0036] Step 3: Slowly lower the temperature of the master alloy in step 2 to 220°C, and at the same time remove the oxide slag, oxide ash and other sundries generated on the surface of the master alloy, then add component (3) anti-oxidation material: Gallium (Ga) 0.2Kg, Add germanium (Ge) 0.3Kg into the master alloy, and keep stirring until it is completely melted to obtain tin-plated copper strip coating anti-oxidation solder alloy.

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Abstract

The invention discloses an anti-oxidation solder alloy for a tin-plated copper strip coating and a preparation method of the anti-oxidation solder alloy. The solder alloy comprises the following components a base material, a reinforcement material and an antioxidant material, wherein the base material comprises 91.5-97% of tin by mass percentage, the reinforcement material comprises the followingcomponents, by mass percentage, 2.0-5.5% of bismuth, 0.5-1.1% of copper and 0.3-0.9% of antimony, and the antioxidant material comprises the following components, by mass percentage, 0.1-0.5% of gallium and 0.1-0.5% of germanium. According to the anti-oxidation solder alloy for the tin-plated copper strip coating, the tin base material is adopted to form high-temperature liquid tin at 360 DEG C, asmall amount of bismuth, copper and antimony is used as the reinforcement material for cooling down to 220 DEG C, meanwhile, the oxide slag, oxide ash and other impurities generated on the surface layer of the master alloy are removed, the anti-oxidation material such as gallium and germanium is added, continuous stirring is conducted until thorough melting to obtain the anti-oxidation solder alloy for the tin-plated copper strip coating, the solder alloy formula and process of tin plating of a tin-plated copper strip are simple, and the service life and reliability of the tin-plated copper strip are prolonged and improved.

Description

technical field [0001] The invention relates to the technical field of tinned copper strip production in the solar photovoltaic industry, in particular to a tinned copper strip coating anti-oxidation solder alloy and a preparation method thereof. Background technique [0002] Tin-plated copper strips are the main components used in solar photovoltaic industry assembly. The quality and reliability of the tin-plated layer directly affect the service life of the assembled products. [0003] At present, the domestic tinned copper strip industry mainly uses pure tin solder. During the hot-dip tinning process, pure tin solder is likely to cause uneven thickness of the coating surface. When the coating surface is in a high temperature or humid environment, surface oxidation and copper strip hair black, resulting in continuous corrosion on the surface of the coating, affecting the soldering effect of the tinned copper strip in subsequent production, and ultimately damaging the produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 唐欣夏杰吴晶李维俊张瑜廖高兵
Owner 深圳市唯特偶新材料股份有限公司
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