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A Method for Detecting the Distribution of Residual Copper Layers in Printed Circuit Boards

A technology for printed circuit boards and copper layers, which is applied in the direction of chemical reaction of materials and material analysis by observing the influence of chemical indicators, so as to meet the requirements of surface quality detection and the effect of simple detection methods.

Active Publication Date: 2021-03-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, this method requires that the size of the defect must be larger than the image unit, otherwise it cannot be measured, so the remaining copper spots that are not etched on the resin surface and cannot be seen by the naked eye cannot be detected by AOI

Method used

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  • A Method for Detecting the Distribution of Residual Copper Layers in Printed Circuit Boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] (1) Preparation of auxiliary solution and detection solution

[0031] Preparation of auxiliary solution: Add 200ml of deionized water into a 500mL beaker, pipette 20ml of concentrated hydrochloric acid into the beaker, and stir. Weigh 5g of stannous chloride, add a small amount to the beaker several times, and stir. Finally add deionized water to the 500mL mark;

[0032] Preparation of test solution: Add 200ml of deionized water into a 500mL beaker, pipette 5ml of concentrated hydrochloric acid into the beaker, and stir. Weigh 0.125g of palladium chloride, add deionized water into the beaker, and stir. Finally add deionized water to the 500mL mark.

[0033] (2) Making printed circuit boards

[0034] The substrate goes through the pre-processing line and enters the exposure process. The model DG-38 photoresist dry film is pasted on the substrate, the circuit data is uploaded and the exposure energy of the LDI exposure machine is set to 16KJ for exposure. When expose...

Embodiment 2

[0039] (1) Preparation of auxiliary solution and detection solution

[0040]Preparation of auxiliary solution: Add 200ml of deionized water into a 500mL beaker, pipette 5ml of concentrated hydrochloric acid into the beaker, and stir. Weigh 20g of stannous chloride, add a small amount to the beaker several times, and stir. Finally add deionized water to the 500mL mark;

[0041] Preparation of test solution: Add 200ml of deionized water into a 500mL beaker, pipette 5ml of concentrated hydrochloric acid into the beaker, and stir. Weigh 0.25g of palladium chloride, add deionized water into the beaker, and stir. Finally add deionized water to the 500mL mark.

[0042] (2) Making printed circuit board circuits

[0043] The substrate goes through the pre-processing line and enters the exposure process. The model DG-38 photoresist dry film is pasted on the substrate, the circuit data is uploaded and the exposure energy of the LDI exposure machine is set to 16KJ for exposure. When ...

Embodiment 3

[0047] (1) Preparation of auxiliary solution and detection solution

[0048] Auxiliary solution preparation: Add 200ml of deionized water into a 500mL beaker, pipette 55ml of concentrated hydrochloric acid into the beaker, and stir. Weigh 50g of stannous chloride, add a small amount to the beaker several times, and stir. Finally add deionized water to the 500mL mark;

[0049] Preparation of test solution: Add 200ml of deionized water into a 500mL beaker, pipette 5ml of concentrated hydrochloric acid into the beaker, and stir. Weigh 0.1 g of palladium chloride, add deionized water into the beaker, and stir. Finally add deionized water to the 500mL mark.

[0050] (2) Making printed circuit board circuits

[0051] The substrate goes through the pre-processing line and enters the exposure process. The dry film of Hitachi 1333 photoresist is used to paste the substrate on the substrate. The circuit data is uploaded and the exposure energy of the LDI exposure machine is set to 1...

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Abstract

The invention relates to a method for detecting residual copper layer distribution of a printed circuit board, and belongs to the technical field of chemical engineering. The method comprises the steps that: an auxiliary solution containing stannous chloride and a detection solution containing palladium chloride are adopted to act with the etched copper layer, copper dots or copper seed in sequence, so that an observed black product can be formed, wherein the auxiliary solution is used for enabling divalent tin ions to permeate and be adsorbed on a residual copper layer, copper dots or copperteeth, palladium ions in the detection solution can be reduced into black dot palladium metal by the divalent tin ions adsorbed on the copper and the copper, and the black dot palladium metal can be obviously observed by naked eyes, so that the distribution of the residual copper is detected. The detection method provided by the invention is simple, convenient, accurate and safe, and can meet thesurface quality detection requirement in the production process of the printed circuit board.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and in particular relates to a method for detecting the distribution of residual copper layers of printed circuit boards. Background technique [0002] With the development of high integration, high density of integrated circuits and high frequency and high speed of digital signal transmission, PCB is now developing towards miniaturization, high density, high stability and integration. Therefore, the line width and line spacing of the surface circuit design of the printed circuit board are getting smaller and smaller, and have developed to the micron level. In the production process of printed circuit boards, etching and making fine lines in the DES process is one of the important links. Acidic solutions are often used to etch away the copper layer other than the lines protected by the dry film. In this process, factors such as solution concentration, temperature, flow rate, and corros...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/77
CPCG01N21/77
Inventor 周国云张秀梅何为王守绪陈滔张彬彬杨猛飞景明毕建民谭建容
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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