Acrylic modified low-dielectric fluorine-containing polyphenylene ether hybrid adhesive and its 5g copper clad laminate

Abstract

The invention relates to an acrylic-modified low-dielectric fluorine-containing polyphenylene ether mixed adhesive and a 5G copper clad laminate prepared therefrom. Phenyl ether, crosslinking agent, initiator, flame retardant, polymerization inhibitor, silane coupling agent, filler and solvent A. The 5G copper-clad laminate prepared by acrylic modified low-dielectric fluorine-containing polyphenylene ether hybrid adhesive is conducive to the transmission of high-frequency and high-speed 5G signals, and can be used in the field of next-generation high-frequency and high-speed boards. The multifunctional double bond acrylic acid-terminated fluorine-containing polyphenylene ether can further increase the crosslinking density of the copper clad laminate coating and improve the comprehensive mechanical strength of the copper clad laminate.

Description

Acrylic modified low dielectric fluorine-containing polyphenylene oxide hybrid adhesive and its 5G copper clad laminate technical field The present invention relates to a kind of acrylic acid modified low-dielectric fluorine-containing polyphenylene ether mixed glue, especially relate to acrylic acid modified low Dielectric fluorine-containing polyphenylene ether hybrid adhesive and its preparation for low-dielectric, high-frequency, high-speed 5G copper clad laminates. Background technique With the development of communication technology, especially the arrival of the 5G era, the amount of data transmitted by the signal is getting larger and larger, and the low time The extension characteristic requires a large amount of data and high-speed transmission, so the performance of high-frequency and high-speed printed circuit boards is getting higher and higher. Electric insulators with less high-frequency transmission loss and excellent electrical properties have become t...

AI Technical Summary

Problems solved by technology

The above-mentioned solutions can reduce the dielectric constant to a certain extent, but with the development of 5G technology, the dielectric constant of the existing solutions needs to be further reduced to meet the requirements for high-frequency and high-speed 5G signal transmission in the future.

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