Lead frame deoxidizer and preparation method and application thereof

A technology of lead frame and oxidant, which is applied in jewelry and other fields, can solve the problems of poor environmental protection and toxicity, and achieve the effect of good environmental protection and strong metallic luster

Active Publication Date: 2020-08-04
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the lack of oxidizers that can be shared by copper substrates and iron-nickel-based lead frames in the market, and the current market Most of the deoxidizers use inorganic strong acid formulations, which have high toxicity and poor environmental protection, and then provide a lead frame deoxidizer, its preparation method and application

Method used

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  • Lead frame deoxidizer and preparation method and application thereof
  • Lead frame deoxidizer and preparation method and application thereof
  • Lead frame deoxidizer and preparation method and application thereof

Examples

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preparation example Construction

[0034] 1. Preparation of lead frame to remove oxidant

[0035] In the embodiment of the present invention, the sum of the mass fractions of the components for removing the oxidizing agent is 100%.

[0036] In the examples of the present invention, the % in the table refers to the mass fraction content.

[0037] In the examples of the present invention, PVP refers to polyvinylpyrrolidone; OP-10 refers to alkylphenol polyoxyethylene ether-10.

[0038] In the embodiments of the present invention, unless otherwise specified, water refers to deionized water.

[0039] In the examples of the present invention, unless otherwise specified, the operating temperature refers to room temperature conditions.

[0040] In the embodiments of the present invention, unless otherwise specified, the deoxidizer refers to the deoxidizer of the lead frame.

[0041] In the embodiment of the present invention, the preparation method for removing the oxidizing agent of the lead frame is carried out i...

Embodiment 1-10

[0043] Table 1

[0044]

[0045]

[0046] Table 2

[0047]

[0048]

Embodiment 11-24

[0050] table 3

[0051]

[0052] Examples 11-24 are on the basis of Example 5, the content of each component in the oxidizing agent is changed higher or lower, and the amount of water is adjusted accordingly, so that the sum of the mass fractions of each component is 100%.

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PUM

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Abstract

The invention discloses a lead frame deoxidizer and a preparation method and application thereof. The deoxidizer comprises, by mass, 30%-50% of organic acid, 0.1%-5% of corrosion inhibitor, 0.1%-1% ofactivator, 0.1%-5% of antioxidant, 2%-4% of brightener, 0.1%-1% of anionic surfactant, 0.1%-1% of polyvinylpyrrolidone and water, and the total mass fraction of the components is 100%; and the K value of the polyvinylpyrrolidone is 30. The deoxidizer is mild and free of toxicity and has high environmental friendliness; and the deoxidizer is suitable for deoxidization of copper-based lead frames and iron-nickel-based lead frames at the same time, and after deoxidization, the surfaces of base materials are bright and smooth and have a polished effect with high metallic luster.

Description

technical field [0001] The invention relates to a lead frame deoxidizer, its preparation method and application. Background technique [0002] Under the background of the European Union's ROHS and WEEE directives, the pure tin plating of the lead pins has been widely promoted, but the problem of discoloration of the pure tin plating has begun to trouble everyone. The discoloration of the tin coating has a lot to do with its pre-treatment process. If the pre-treatment process is not effective, it will directly lead to rough tin coating, high porosity and subsequent discoloration. At present, the commonly used lead frame substrates are copper-based and iron-nickel-based. In order to reduce costs, these two substrates generally contain other metal impurities or alloy materials, and only a 0.5-2 μm thick relatively pure metal thin layer is plated on the top layer. This thin layer is very easy to oxidize and deteriorate, which will greatly reduce the bonding force between the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/34C25D7/00
CPCC25D5/34C25D7/00
Inventor 王溯蒋闯
Owner SHANGHAI SINYANG SEMICON MATERIALS
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