Surface conformal circuit direct writing device based on laser sintering principle

Abstract

The invention discloses a curved surface conformal circuit direct writing device based on a laser sintering principle. The device comprises components and connection conditions as follows: a Y-axis stepping motor lead screw is mounted on the bracket, an X-axis stepping motor lead screw is installed on a sliding block of a Y-axis stepping motor lead screw, a Z-axis fixing part is installed on a sliding block of an X-axis stepping motor lead screw, a linear guide rail is connected with the Z-axis fixing part, a Z-axis sliding block is installed on the linear guide rail, a Z-axis spring is arranged between the Z-axis fixing part and the Z-axis sliding block, a universal ball walking unit is installed on the Z-axis sliding block through a sliding block connecting piece, and Y-axis and X-axis stepping motor lead screws are connected with a motor driving device; external equipment is connected with the motor driving device; and a laser output mechanism is installed on the universal ball walking unit through a base. The device is simple in structure, the operation and maintenance cost is reduced, and a circuit can be stably and directly written on a curved surface with a large fluctuationdegree.

Description

technical field [0001] The invention relates to the technical field of micro-printed circuit manufacturing technology, in particular to a curved surface conformal circuit direct writing device based on the principle of laser sintering. Background technique [0002] The direct-writing manufacturing of micro-printed circuit electronic components is a micro-circuit manufacturing process that has emerged in recent years; compared with microelectronic components produced by traditional manufacturing processes (lithography, chemical etching, etc.), Chips, thin film resistors, thin film inductors, thin film capacitors and other devices have smaller volume and better performance; at the same time, compared with traditional manufacturing processes, the direct writing manufacturing process of microelectronic circuits has less pollution, less waste of raw materials, and is environmentally friendly In addition, micro-printed circuit electronic components directly written on flexible sub...

AI Technical Summary

Problems solved by technology

[0003] But so far, the direct writing process of microelectronic components is still limited to planar substrates

On a flat substrate, the usual direct writing manufacturing process is to place the flat substrate on a high-level storage table, use a micro-pen to move on the flat substrate according to the set program and eject conductive ink, and obtain a flat surface after subsequent processing. The finished direct-writing circuit on the substrate; on the curved substrate, the general method is to use scanning modeling to first obtain the parameters of the curved substrate, and then use the multi-axis platform to manipulate the micro-pen direct writing and other devices to obtain the direct writing circuit and electronic components on the curved surface. components; or adjust the distance between the direct writing pen tip and the substrate in real time through a high-precision distance sensor to realize the ability to directly write circuits and electronic components on curved surfaces; although the above methods are relatively mature, it is a pity that too many multi-axis platforms, Accurate scanning equipment, sensors and other devices will cause problems such as high cost, difficult maintenance, and complicated operation

Images