A highly stable metal-modified boron-doped diamond electrode and its preparation method and application
A boron-doped diamond and metal modification technology, which is applied in the field of high-stability metal-modified boron-doped diamond electrodes and its preparation, can solve problems such as limited application, and achieve the effect of excellent stability
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Embodiment 1
[0033] Step 1. Place the silicon wafer substrate in an acetone solution, ultrasonically clean it for 15 minutes, then ultrasonically clean it in deionized water for 2 minutes, and dry it. Through the above treatment, oil stains on the surface of the substrate are removed, and a clean and dry substrate is obtained. Then suspend and immerse the clean and dry substrate into the suspension of nano-diamond powder for 30 minutes, and finally wash and dry with alcohol to obtain a silicon wafer substrate with nano-diamond particles adsorbed on the surface, and then absorb nano-diamond particles on the surface. The silicon wafer substrate is placed in chemical vapor deposition method for hot wire chemical vapor deposition to obtain the first layer of boron-doped diamond film, the number of hot wire turns is 12 turns, the distance between the hot wire and the substrate is 10cm, and the mass flow ratio of the gas introduced is for B 2 h 6 :H 2 :CH 4 =0.4:49:1, the growth pressure is ...
Embodiment 2
[0040] Step 1. Place the silicon wafer substrate in an acetone solution, ultrasonically clean it for 15 minutes, then ultrasonically clean it in deionized water for 2 minutes, and dry it. Through the above treatment, oil stains on the surface of the substrate are removed, and a clean and dry substrate is obtained. Then suspend and immerse the clean and dry substrate into the suspension of nano-diamond powder for 30 minutes, and finally wash and dry with alcohol to obtain a silicon wafer substrate with nano-diamond particles adsorbed on the surface, and then absorb nano-diamond particles on the surface. The silicon wafer substrate is placed in chemical vapor deposition method for hot wire chemical vapor deposition to obtain the first layer of boron-doped diamond film, the number of hot wire turns is 12 turns, the distance between the hot wire and the substrate is 10cm, and the mass flow ratio of the gas introduced is for B 2 h 6 :H 2 :CH 4 =0.5:49:1, the growth pressure is ...
Embodiment 3
[0048] Step 1. Place the silicon wafer substrate in an acetone solution, ultrasonically clean it for 15 minutes, then ultrasonically clean it in deionized water for 2 minutes, and dry it. Through the above treatment, oil stains on the surface of the substrate are removed, and a clean and dry substrate is obtained. Then suspend and immerse the clean and dry substrate into the suspension of nano-diamond powder for 30 minutes, and finally wash and dry with alcohol to obtain a silicon wafer substrate with nano-diamond particles adsorbed on the surface, and then absorb nano-diamond particles on the surface. The silicon wafer substrate is placed in chemical vapor deposition method for hot wire chemical vapor deposition to obtain the first layer of boron-doped diamond film, the number of hot wire turns is 12 turns, the distance between the hot wire and the substrate is 10cm, and the mass flow ratio of the gas introduced is for B 2 h 6 :H 2 :CH 4 =0.6:49:1, the growth pressure is ...
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