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A kind of sintering fixture and sintering method of high-power conduction cooling package structure bar laser

A technology of conduction cooling and packaging structure, used in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of difficult to guarantee the consistency of bar sintering, small contact area of ​​spring probes, and inability to completely cover the bars, etc., and achieve stability. Good reproducibility and repeatability, shortened sintering time, improved package stability and consistency

Active Publication Date: 2022-04-01
潍坊华光光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Chinese patent document CN205282874U discloses "a high-power laser bar chip sintering fixture", which uses five spring probes to apply pressure to the bar, and is provided with threads and adjustable bolts to adjust the pressure, but in adjusting the balance to improve There is no reference standard in the process of "smile" effect, and the adjustable bolts of the five probes need to be constantly adjusted, which makes the operation process more complicated; secondly, it is difficult to guarantee the consistency of the sintering of the bar, which may affect the sintering pass rate; in addition, the spring The contact area of ​​the probe is small and cannot completely cover the bar as a whole, which may easily cause uneven pressure and sintering voids

Method used

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  • A kind of sintering fixture and sintering method of high-power conduction cooling package structure bar laser
  • A kind of sintering fixture and sintering method of high-power conduction cooling package structure bar laser
  • A kind of sintering fixture and sintering method of high-power conduction cooling package structure bar laser

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Effect test

Embodiment 1

[0039] Such as Figure 1~5 As shown, a sintering fixture for a bar laser with a high-power conduction cooling package structure includes a positioning base 1, a CS heat sink 2, a pressing block 4, and a bar laser 3. The positioning base 1 includes a first surface 101 and a second surface 102, The first surface 101 and the second surface 102 are arranged perpendicular to each other. The first surface 101 is provided with a first limiting groove 103 for limiting the bottom of the CS heat sink 2, and the second surface 102 is provided with a groove for limiting the CS heat sink. One end of Shen 2 is used for limiting the second limiting groove 104;

[0040]The width of the pressing block 4 is consistent with the width of the bar laser 3, which can not only ensure that the entire surface of the bar laser 3 is evenly stressed, but also facilitate the observation and adjustment of the placement position through the microscope during the placing process. One end of the lower surface ...

Embodiment 2

[0043] A sintering fixture for a bar laser with a high-power conduction cooling package structure, the structure is as shown in Embodiment 1, the difference is that the upper side of the second limiting groove 104 is provided with a bar for limiting the bar laser 3 and the pressing block 4. The limit side 105 of the position, the bottom of the limit side 105 is about 50 μm higher than the upper surface of the CS heat sink 2, to ensure that the light output surface of the CS heat sink 2 and the bar laser 3 is flush, and the bar laser 3 is in the Middle of CS heat sink 2.

Embodiment 3

[0045] A sintering fixture for a bar laser with a high-power conduction cooling package structure, the structure is as shown in Embodiment 1, the difference is that the CS heat sink 2 is provided with a positioning hole, the pressing block 4 is provided with a fastening hole 402, and the positioning hole The fastening bolt 5 is used to fasten the fastening hole 402. The present invention uses the positioning hole of the CS heat sink itself to fix the compact, so that the CS heat sink itself becomes an integral part of the sintering fixture;

[0046] The clamping hole 403 is also provided on the briquetting block 4 to facilitate the clamping of the briquetting block 4 after sintering

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Abstract

The invention relates to a sintering fixture for a bar laser with a high-power conduction cooling package structure and a sintering method thereof, belonging to the field of semiconductor laser manufacturing, including a positioning base, a CS heat sink, a pressing block, and a bar laser. The positioning base includes a first surface and a second surface. Two surfaces, the first surface and the second surface are arranged perpendicular to each other, the first surface is provided with a first limiting groove, and the second surface is provided with a second limiting groove; the width of the pressing block is consistent with the width of the bar laser, One end of the lower surface of the pressing block is provided with a pressing part for pressing the bar laser, the height of the pressing part is lower than that of the pressing block, and the size of the pressing part is consistent with the size of the bar laser. The invention makes full use of the structural characteristics of the CS heat sink, simplifies the fixture structure, not only can reduce or even avoid the occurrence of the "smile" phenomenon, but also can ensure the consistency and uniformity of sintering by using a torque screwdriver, and improve the efficiency of bar sintering. Efficiency and pass rate.

Description

technical field [0001] The invention relates to a sintering fixture for a bar laser with a high-power conduction cooling package structure and a sintering method thereof, belonging to the field of semiconductor laser manufacturing. Background technique [0002] With the rapid development of semiconductor material technology and laser packaging technology, high-power laser diode single-tube devices and array devices have developed rapidly at home and abroad, and have become the main direction of the current laser industry application expansion. Semiconductor lasers have the advantages of small size, high efficiency, and low cost, so they are widely used in technical fields such as laser medical treatment, laser display, industrial processing, military weapons, solid-state lasers, and fiber laser pumps. The three main parameters of semiconductor lasers include output optical power, photoelectric conversion efficiency and reliability, and heat is one of the most important facto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/02315
Inventor 姚爽王帅纪兴启开北超夏伟徐现刚
Owner 潍坊华光光电子有限公司