Resin packaging material and preparation method of QLED device
A technology of resin encapsulation and epoxy resin, which is applied in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., can solve the problem that the water-oxygen isolation effect of UV resin cannot well meet the requirements of use, and the service life of QLED devices is difficult to achieve performance requirements etc.
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[0018] In the first aspect, the embodiment of the application provides a method for preparing a resin encapsulation material, including:
[0019] S1. The epoxy resin is modified with a fluorinated substance to obtain a fluorine-modified system.
[0020] The fluorinated substance has excellent chemical corrosion resistance, weather resistance and hydrophobicity and oleophobicity, and can improve the hydrophobicity of the epoxy resin, so that the prepared resin encapsulation material has a good water-oxygen isolation effect. At the same time, fluorinated substances have good self-cleaning properties and high light transmittance, which can better meet the performance requirements of packaging materials.
[0021] It can be understood that, in the embodiment of the present application, the treatment of the epoxy resin by the fluorinated substance may be chemical treatment or physical treatment. The types of fluorinated substances are not limited, and can be selected according to t...
Embodiment 1
[0062] A method for preparing a resin encapsulation material, comprising:
[0063] S1. Add epoxy resin and butyl acetate into a four-neck flask equipped with a stirring paddle, a constant pressure funnel, a condenser tube and a thermometer, stir and raise the temperature to 110°C to dissolve the epoxy resin. Add the mixed solution of hexafluorobutyl methacrylate, 2-hydroxy-2-methyl-1-phenyl-1-propanone and methyl methacrylate dropwise at a rate of 8-10 drops / min through a constant pressure funnel into a four-neck flask. After the dropwise addition, the reflux reaction was continued for 1 h to obtain a fluorine-modified system.
[0064] S2. Cool down the system to 90°C, drop the mixed solution of dimer acid and N,N-dimethylbenzylamine into the four-necked flask through a constant pressure funnel, and measure the acid value every 15 minutes until the acid value of the system Drop <3.5mg KOH / g.
[0065] S3. itaconic acid is added in the four-necked flask, and the mixed solutio...
Embodiment 2
[0069] A method for preparing a resin encapsulation material, comprising:
[0070] S1. Add epoxy resin and butyl acetate into a four-neck flask equipped with a stirring paddle, a constant pressure funnel, a condenser tube and a thermometer, stir and raise the temperature to 110°C to dissolve the epoxy resin. Add the mixed solution of hexafluorobutyl methacrylate, 2-hydroxy-2-methyl-1-phenyl-1-propanone and methyl methacrylate dropwise at a rate of 8-10 drops / min through a constant pressure funnel into a four-neck flask. After the dropwise addition, the reflux reaction was continued for 1 h to obtain a fluorine-modified system.
[0071] S2. Cool the system down to 85°C, drop the mixed solution of dimer acid and N,N-dimethylbenzylamine into the four-necked flask through a constant pressure funnel, and measure the acid value every 15 minutes until the acid value of the system Drop <3.5mg KOH / g.
[0072] S3. itaconic acid is added in the four-necked flask, and the mixed solutio...
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