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Polyurethane patch adhesive and preparation method thereof

A technology of patch glue and polyurethane, applied in the direction of polyurea/polyurethane adhesive, adhesive, adhesive type, etc. Short curing time, low curing temperature, and the effect of enhancing joint reliability

Pending Publication Date: 2020-09-18
李枫
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the patch red glue on the market mainly has the following problems: poor shape of glue dots; low wet strength; high curing temperature and slow speed; large curing shrinkage rate, poor high temperature resistance and high drop rate, so it cannot meet the current and future requirements at all. Requirements for the use of high-end technology

Method used

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  • Polyurethane patch adhesive and preparation method thereof
  • Polyurethane patch adhesive and preparation method thereof
  • Polyurethane patch adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A kind of polyurethane patch glue, is made up of following raw material according to mass percentage:

[0048] Polyether TPU 35%, polyester TPU 45%, tackifying resin 5%, coupling agent 0.5%, antioxidant 3%, flame retardant 3%, initiator 0.5%, inorganic filler 6%, epoxy Curing agent 2%.

[0049] The coupling agent is a titanate coupling agent NDZ-201, and the peel strength of the polyurethane patch adhesive added with the titanate coupling agent NDZ-201 is greatly improved after pasting, and there is still a high Peel strength. Due to the existence of amphoteric groups in the coupling agent, the hydrophilic group is more conducive to bonding, and the lipophilic (hydrophobic) group is hydrophobic, repels water and is not easy to immerse between the polyurethane patch adhesive and the adhesive product.

[0050] The tackifying resin is compounded by terpene resin and hydrogenated C5 resin according to the ratio of 15:1. The combination of terpene resin and hydrogenated C...

Embodiment 2

[0060] A kind of polyurethane patch glue, is made up of following raw material according to mass percentage:

[0061] Polyether TPU 45%, polyester TPU 15.3%, tackifying resin 12%, coupling agent 1%, antioxidant 6%, flame retardant 6%, initiator 1.2%, inorganic filler 10%, epoxy Curing agent 3.5%.

[0062] The coupling agent is a titanate coupling agent NDZ-201, and the peel strength of the polyurethane patch adhesive added with the titanate coupling agent NDZ-201 is greatly improved after pasting, and there is still a high Peel strength. Due to the existence of amphoteric groups in the coupling agent, the hydrophilic group is more conducive to bonding, and the lipophilic (hydrophobic) group is hydrophobic, repels water and is not easy to immerse between the polyurethane patch adhesive and the adhesive product.

[0063] The tackifying resin is compounded by terpene resin and hydrogenated C5 resin according to the ratio of 18:1. The combination of terpene resin and hydrogenat...

Embodiment 3

[0073] A kind of polyurethane patch glue, is made up of following raw material according to mass percentage:

[0074] Polyether TPU 40%, polyester TPU 30.7%, tackifying resin 8%, coupling agent 0.8%, antioxidant 4.5%, flame retardant 4.5%, initiator 0.8%, inorganic filler 8%, epoxy Curing agent 2.7%.

[0075] The coupling agent is a titanate coupling agent NDZ-201, and the peel strength of the polyurethane patch adhesive added with the titanate coupling agent NDZ-201 is greatly improved after pasting, and there is still a high Peel strength. Due to the existence of amphoteric groups in the coupling agent, the hydrophilic group is more conducive to bonding, and the lipophilic (hydrophobic) group is hydrophobic, repels water and is not easy to immerse between the polyurethane patch adhesive and the adhesive product.

[0076] The tackifying resin is compounded by terpene resin and hydrogenated C5 resin according to the ratio of 16:1. The combination of terpene resin and hydrog...

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Abstract

The invention discloses a polyurethane patch adhesive. The polyurethane patch adhesive is prepared from, by mass, 35-45% of polyether type TPU, 15.3-45% of polyester type TPU, 5-12% of tackifying resin, 0.5-1% of a coupling agent, 3-6% of an antioxidant, 3-6% of a flame retardant, 0.5-1.2% of an initiator, 6-10% of an inorganic filler and 2-3.5% of an epoxy curing agent. The prepared patch adhesive is excellent in storage stability, good in thixotropy, high in wet strength, low in curing temperature and short in curing time and has a good bonding effect on various components, and the high-temperature resistance and the piece falling rate are obviously improved.

Description

technical field [0001] The invention relates to the technical field of electronic adhesives, in particular to a polyurethane patch adhesive and a preparation method thereof. Background technique [0002] In response to today's global environmental protection standards, the microelectronics industry requires the use of lead-free soldering technology in some links. However, the material of lead-free soldering is highly brittle, resulting in undesirable defects in the heat treatment process cycle during the soldering assembly process. Especially due to the increased brittleness of lead-free solder and the unbalanced thermal stress accumulated during soldering, when the finished component is bumped or dropped, the impact will cause micro-cracks in the solder joints, so the signal will also be weakened or lost, and even the end product will fail. Current dispensing techniques are inefficient and unable to rework circuit boards with defective issues. [0003] The current dispens...

Claims

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Application Information

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IPC IPC(8): C09J175/06C09J175/08C09J11/04C09J11/06C09J11/08
CPCC09J175/06C09J175/08C09J11/04C09J11/06C09J11/08C08L2205/02C08L2205/035C08K2201/011C08L2203/206C08L2207/04C08L2201/02C08L2201/08C08L75/08C08L45/00C08L57/02C08K13/04C08K7/26C08K3/34C08K3/346C08L75/06
Inventor 李枫
Owner 李枫
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