Chemical silver plating solution and preparation method thereof

A technology for electroless silver plating and silver salt, applied in the field of electrochemistry, can solve the problems of poor electroless plating stability, insufficient coating thickness, and substandard coating performance.

Pending Publication Date: 2020-09-22
SHENZHEN WAVE TELECOMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in actual industrial applications, chemical plating has problems such as poor stability, insufficient coating thickness, and substandard coating performance.

Method used

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  • Chemical silver plating solution and preparation method thereof
  • Chemical silver plating solution and preparation method thereof

Examples

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preparation example Construction

[0034] The preparation method of the electroless silver plating solution of an embodiment, comprises the steps:

[0035] Mix raw materials including silver salt with a final concentration of 0.5g / L-5g / L, complexing agent with a final concentration of 1.5g / L-40g / L and reducing agent with a final concentration of 2.5g / L-30g / L Wherein, the above-mentioned complexing agent is selected from at least one of disodium edetate, triethylenetetramine, ammonium citrate, ammonium sulfate and ammonium bifluoride; the above-mentioned reducing agent is selected from one of sodium potassium tartrate and glucose species; the brightener is at least one selected from glycerin, ethylene glycol, glycine and polyethylene glycol with a relative molecular mass of 500-4000.

[0036] Specifically, the above-mentioned specific steps of mixing silver salt, complexing agent and reducing agent include:

[0037] dissolving the complexing agent in water to obtain a first solution;

[0038] adding an aqueous...

specific Embodiment

[0042] The following will be described in detail in conjunction with specific embodiments. The following examples do not include other components except unavoidable impurities, unless otherwise specified. The drugs and instruments used in the examples are all routine choices in the art unless otherwise specified. The experimental methods for which specific conditions are not indicated in the examples are implemented according to conventional conditions, such as conditions described in literature, books or methods recommended by the manufacturer.

[0043] Examples and comparative examples

[0044] Prepare the electroless silver plating solution:

[0045] Take deionized water as solvent preparation each embodiment and the electroless silver plating solution of comparative example, wherein each embodiment and the final concentration of the raw material of the chemical silver plating solution of comparative example and each raw material in chemical silver plating solution are as...

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PUM

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Abstract

The invention relates to a chemical silver plating solution and a preparation method thereof. The chemical silver plating solution comprises silver salt with final concentration of 0.5 g / L-5 g / L, a complexing agent with final concentration of 1.5 g / L-40 g / L and a reducing agent with final concentration of 2.5 g / L-30 g / L; the complexing agent is selected from at least one of disodium ethylenediaminetetraacetic acid, triethylenetetramine, ammonium citrate, ammonium sulfate and ammonium bifluoride; and the reducing agent is selected from one of potassium sodium tartrate and glucose. The components of the chemical silver plating solution are selected appropriately, and the ratio is reasonable; and tests show that the chemical silver plating solution has good stability, proper plating thicknessand good quality.

Description

technical field [0001] The invention relates to the technical field of electrochemistry, in particular to an electroless silver plating solution and a preparation method thereof. Background technique [0002] Silver is widely used in printed circuit board (PCB) and decoration industries, usually through silver plating, because of its excellent electrical and thermal conductivity and decorative properties. There are electroplating and electroless plating methods for silver plating. Electroless plating is gradually replacing electroplating and has become a research hotspot due to its advantages of low cost and simplicity, dense coating and uniform adhesion. [0003] However, in actual industrial applications, electroless plating has problems such as poor stability, insufficient coating thickness, and substandard coating performance. Contents of the invention [0004] Based on this, it is necessary to provide an electroless silver plating solution with good stability, suitab...

Claims

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Application Information

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IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 张少林柳超董格袁磊柯浪滔
Owner SHENZHEN WAVE TELECOMM TECH CO LTD
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