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Computer memory bank manufacturing device for quantitatively dispensing solder paste

A production device and computer technology, applied in the direction of tin feeding device, manufacturing tools, welding/welding/cutting items, etc., can solve the problems of large volume of automatic solder paste dispensing machine, unsuitable for small enterprises, waste of materials, etc.

Inactive Publication Date: 2020-10-23
杭州灿鹏能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The computer is composed of a hardware system and a software system. The hardware is something that can be seen and touched. The software is a data program. The memory stick is one of the main hardware in the computer, which provides a large memory space for the computer. The memory stick is in the process of making It mainly includes several main steps such as preparation, dispensing solder paste, inspection, function test, and packaging. When dispensing solder paste, it mainly includes two methods, including manual operation and automatic solder paste machine operation. When operating, it is generally necessary to use a scraper to scrape off the solder paste, and then apply it on the surface of the memory stick. However, there are errors in the manual operation. When there is more solder paste, it will cause waste of materials, and when there is less solder paste, it will It affects the pasting of memory sticks, resulting in low work efficiency and pass rate when making memory sticks, while the automatic solder paste dispensing machine is large in size and high in production cost, so it is not suitable for small enterprises to operate
[0004] In order to solve the above problems, the inventor proposed a computer memory bar manufacturing device for quantitatively dispensing solder paste, which has the advantages of quantitative automatic dispensing of solder paste and low cost, and solves the problem that the operation of dispensing solder paste is expensive and cannot be guaranteed. The problem of quantitative operation ensures more intelligent operation when using the device, thereby improving the work efficiency and pass rate of memory sticks

Method used

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  • Computer memory bank manufacturing device for quantitatively dispensing solder paste
  • Computer memory bank manufacturing device for quantitatively dispensing solder paste
  • Computer memory bank manufacturing device for quantitatively dispensing solder paste

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-5 , a computer memory bar manufacturing device for quantitatively dispensing solder paste, including a storage box 1, using the storage box 1 to store raw materials, the outer side of the storage box 1 is movably connected with a baffle 2, and using the opening and closing of the baffle 2 Close controls the opening and closing of the storage box 1. The first connecting rod 3 is movably connected to the bottom of the baffle 2. The movement ...

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Abstract

The invention relates to the technical field of computer software and hardware, and discloses a computer memory bank manufacturing device for quantitatively dispensing solder paste. The device comprises a storage box, through the cooperative use of the storage box, a baffle, a first connecting rod and a symmetric disc, the opening and closing of the storage box can be automatically controlled, thestorage box is automatically opened when needed and is automatically closed when not needed, so that the solder paste is isolated from the outside, and the solder paste is prevented from being exposed in the air to cause oxidation; through the cooperative use of a piston, a push rod, a second connecting rod, a moving plate and a pinion, the solder paste is automatically extruded when the baffle is opened, and the extrusion amount of each time is kept consistent, so that the quality of a chip is prevented from being reduced due to too much or too little solder paste, and the percent of pass ofproducts is improved; and through the cooperative use of a second rotating disc, a sleeve rod, a rotating shaft, a first gear and a special-shaped disc, the movement of the baffle and the piston is linked, so that the linkage of the whole device is improved, and the operation is simpler.

Description

technical field [0001] The invention relates to the technical field of computer software and hardware, in particular to a computer memory bar manufacturing device for quantitatively dispensing solder paste. Background technique [0002] Computers, commonly known as computers, are modern electronic computing machines used for high-speed computing. They can perform numerical calculations and logical calculations. They have storage and memory functions, can run according to programs, and process massive amounts of data automatically and at high speed. They are used in various industries and consumption. Equipment control systems, including simple special-purpose equipment, industrial equipment, and general-purpose equipment. [0003] The computer is composed of a hardware system and a software system. The hardware is something that can be seen and touched. The software is a data program. The memory stick is one of the main hardware in the computer, which provides a large memory...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06B23K101/36
CPCB23K3/0607B23K2101/36
Inventor 张家田
Owner 杭州灿鹏能源科技有限公司
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