Multi-port Power Combination Grid Array Antenna Based on Fan-out Wafer Level Packaging
A technology of wafer-level packaging and grid arrays, which is applied to antenna arrays, antennas, and antenna arrays that are powered separately, can solve problems such as high cost, large chip area, and unfavorable heat dissipation, and achieve low cross-polarization levels and compact Effect of Antenna Size
Active Publication Date: 2022-06-03
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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Problems solved by technology
However, the on-chip antenna has the problems of occupying a large chip area, high cost, and is not conducive to heat dissipation and miniaturization of equipment.
The spherical dielectric feed makes the connection circuit between the antenna radiation unit and the chip too complicated, which is not conducive to the design of the connection circuit
Method used
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Embodiment Construction
[0032] The preferred embodiments of the present invention will be further described in detail below.
[0033] like figure 1 and figure 2 As shown, a multi-port power combination grid array antenna based on a fan-out wafer-level packaging, comprising:
[0034] The radio frequency chip 1 is arranged in the substrate layer 6;
[0035] The antenna radiation unit 2 is located in the first RDL layer and is arranged in a grid array, wherein the feeding point is arranged on the intersection of the long side and the short side of the grid of the antenna radiation unit 2;
[0036] The ground plate 3 is arranged in the second RDL layer above the substrate layer 6; the second RDL layer is located below the first RDL layer;
[0037] The feeding network 4 includes an RDL feeder 5 arranged in the third RDL layer, and the third RDL layer is located below the substrate layer 6;
[0038] The back metal plate of the radio frequency chip 1 is connected to the ground plate 3 to realize heat d...
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The invention provides a multi-port power combined grid array antenna based on fan-out wafer-level packaging, which includes a radio frequency chip arranged in a substrate layer; an antenna radiation unit located in the first RDL layer and formed in a grid Arranged in an array, wherein the feed point is set at the intersection of the long side and the short side of the grid of the antenna radiating element; the ground plate is set in the second RDL layer above the substrate layer; the second RDL layer is located on the second RDL layer The bottom of the first RDL layer; the feed network, including the RDL feeder arranged in the third RDL layer, the third RDL layer is located below the substrate layer; the back metal plate of the radio frequency chip is connected to the ground plate, and the radio frequency of the front end The signal pad is connected to the RDL feeder located at its bottom. By adopting the technical scheme of the present invention, it can be better deployed on wireless terminal equipment without occupying too much space, and at the same time, it can effectively reduce energy loss and heat generation when the antenna is connected to the chip.
Description
technical field [0001] The present invention relates to the technical field of antennas, in particular to a multi-port power combination grid array antenna based on a fan-out wafer-level packaging. Background technique [0002] Millimeter wave has the characteristics of high frequency, short wavelength, wide spectrum, and narrow beam, which can provide high-speed transmission rate and good directivity. In addition, its corresponding antenna has a small physical size, and it is easy to build a large-scale antenna array and integrate it in On the wireless terminal equipment, it is a good fit for the development needs of future communications. As the front-end device of the communication system, the antenna realizes high gain and strong directivity of electromagnetic signal radiation is the premise of the entire communication system, and the small size of the antenna design helps to reduce power consumption and facilitate integration in wireless terminal equipment. The multi-p...
Claims
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IPC IPC(8): H01Q1/22H01Q1/02H01Q1/48H01Q1/50H01Q21/06H01Q23/00
CPCH01Q1/2283H01Q1/02H01Q23/00H01Q1/50H01Q1/48H01Q21/061Y02D30/70
Inventor 陈梓浩钟琳徐镭家王凯旭张钦宇
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL