Fabrication of High Thermal Conductivity Polymer Composites with Dense Isolation Structure by Fiber Embedding

A composite material and isolation structure technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of insufficient thermal conductivity of the heat conduction network, unimproved material mechanical properties, low thermal conductivity of composite materials, etc., to achieve Conducive to industrial production and application, low production cost, and strong industrialization capabilities

Active Publication Date: 2021-09-24
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the filler particle network isolates the polymer particles from each other, resulting in extremely poor mechanical properties of the material with the isolated structure, and the gaps between the filler and the matrix and between the filler and the filler particles due to the low degree of compactness of the isolated structure will also resulting in a relatively low overall thermal conductivity of the composite
[0003] For the problem of insufficient thermal conductivity and low mechanical properties of the heat-conducting polymer composite material with isolated structure, the reported solutions include: through the synergistic effect obtained by the compounding of various fillers of different sizes and types to achieve The purpose of reducing filler content and improving thermal conductivity (ACS Appl.Mater.Interfaces 2017, 9, 7637-7647), however, on the one hand increases production costs, on the other hand, the reduction of filler content sacrifices the material to a certain extent thermal conductivity
There are also some scholars who increase the molding pressure to make the filler network denser to obtain higher thermal conductivity for composite materials with isolated structures (Ind. Eng. Chem. Res. 2018, 57, 10391-10397). Although the thermal conductivity of the composite material has been improved to a certain extent, the mechanical properties of the material have not been improved, and the process is cumbersome, which increases the production cost

Method used

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  • Fabrication of High Thermal Conductivity Polymer Composites with Dense Isolation Structure by Fiber Embedding
  • Fabrication of High Thermal Conductivity Polymer Composites with Dense Isolation Structure by Fiber Embedding

Examples

Experimental program
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Effect test

Embodiment 1

[0025] (1) Select polypropylene 1003, (China Taiwan Plastics Industry Co., Ltd.), melt index is 0.4g / 10min, particle size is 10 μm; polypropylene fiber (Huixiang Fiber Engineering) length 3mm, diameter is 10 μm; nitriding Boron (Dandong Rijin Technology Co., Ltd.) has a particle size of 10 μm; VAE (705, raw material of Shanghai Yingjia Chemical).

[0026] (2) First, mix 3 mm polypropylene fiber with a polypropylene matrix with a particle size of 10 μm in a mass ratio of 1:9, and at the same time, add VAE adhesive with a total mass ratio of 1:3 to polypropylene and polypropylene fiber to Mix uniformly for 1 min at a speed of 25000 rad / min in a high-speed mixer.

[0027] (3) Add boron nitride with a mass ratio of 2:3 to polypropylene and polypropylene fiber as a thermally conductive filler, continue to mix evenly in a high-speed mixer at a speed of 25000rad / min for 1min, and dry in an oven at 80 degrees for 10h .

[0028] (4) Put the final blend into a mold, press plate at 190...

Embodiment 2

[0031] (1) Select polypropylene 1003, (China Taiwan Plastics Industry Co., Ltd.), melt index is 0.4g / 10min, particle size is 3000 μm; polypropylene fiber (Huixiang Fiber Engineering) length 30mm, diameter is 100 μm; nitriding Boron (Dandong Rijin Technology Co., Ltd.) has a particle size of 20 μm; VAE (705, raw material of Shanghai Yingjia Chemical).

[0032] (2) First, mix 30mm polypropylene fibers with a polypropylene matrix with a particle size of 3000 μm in a mass ratio of 1:9, and at the same time, add VAE adhesive with a total mass ratio of 1:3 to polypropylene and polypropylene fibers in Mix uniformly for 1 min at a speed of 25000 rad / min in a high-speed mixer.

[0033](3) Add boron nitride with a mass ratio of 2:3 to polypropylene and polypropylene fiber as a thermally conductive filler, continue to mix evenly in a high-speed mixer at a speed of 25000rad / min for 1min, and dry in an oven at 80 degrees for 10h .

[0034] (4) Put the final blend into a mold, press plate...

Embodiment 3

[0037] (1) Select polypropylene 1003, (China Taiwan Plastic Industry Co., Ltd.), melt index is 0.4g / 10min, particle size is 10 μm; polypropylene fiber (Huixiang Fiber Engineering) length 3mm, diameter is 10 μm; nitriding Boron (Dandong Rijin Technology Co., Ltd.) has a particle size of 10 μm; VAE (705, raw material of Shanghai Yingjia Chemical).

[0038] (2) First, mix 3 mm polypropylene fiber with a polypropylene matrix with a particle size of 10 μm in a mass ratio of 3:7, and at the same time, add VAE adhesive with a total mass ratio of 1:3 to polypropylene and polypropylene fiber to Mix uniformly for 1 min at a speed of 25000 rad / min in a high-speed mixer.

[0039] (3) Add boron nitride with a mass ratio of 2:3 to polypropylene and polypropylene fiber as a thermally conductive filler, continue to mix evenly in a high-speed mixer at a speed of 25000rad / min for 1min, and dry in an oven at 80 degrees for 10h .

[0040] (4) Put the final blend into a mold, press plate at 190°...

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Abstract

The invention discloses a high thermal conductivity polymer composite material with a dense isolation structure prepared by fiber embedding. The composite material is composed of thermal conductive fillers, fibers and polymer particles. The thermal conductivity polymer composite material has a dense structure through fiber embedding. isolation structure. Its main advantage is that compared with the traditional isolation structure, the fiber-penetrated isolation structure has higher thermal conductivity and good mechanical properties. At the same time, in the composite material of the present invention, polymers and fillers do not need special treatment, and The preparation method has simple process, convenient operation and control, high production efficiency, low production cost, strong industrialization ability and broad market prospect.

Description

technical field [0001] The invention relates to a method for synchronously enhancing the thermal conductivity and mechanical properties of a composite material by embedding fibers into an isolation structure, and belongs to the technical field of thermally conductive polymer-based composite materials and their preparation. Background technique [0002] For thermally conductive polymer composites, it is a common and effective solution to increase the content of thermally conductive fillers to form a continuous thermally conductive network, and to promote the composite material to form an isolation structure, that is, thermally conductive particles form a coating on the surface of the polymer, making the filler Particles form a continuous structure to obtain efficient thermal conduction pathways, which is the optimal solution for using thermally conductive fillers in polymers to form a continuous thermally conductive network and maximize the use of thermally conductive fillers....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L31/04C08L79/04C08L23/26C08L23/12C08K7/06C08K3/38C09K5/14
CPCC08K2003/385C08L31/04C08L79/04C08L2205/025C08L2205/03C08L2205/16C09K5/14C08L23/12C08K3/38C08K7/06C08L23/26C08K3/28
Inventor 吴宏李响郭少云
Owner SICHUAN UNIV
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