Copper-clad laminate and printed circuit board
A technology of copper clad laminate and copper foil layer, applied in the directions of printed circuit, printed circuit, circuit substrate material, etc., can solve the problem of low passive intermodulation value and so on
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[0114] Exemplary preparation methods: optionally polybutadiene resins, polyisoprene resins, polyarylether resins, other co-curable polymers, free radical curable monomers, elastomeric block copolymers, initiators , flame retardant, bonding regulator, solvent and other polymer matrix materials and glue mixed with fillers are impregnated or coated with reinforcing materials (E glass cloth), passed through the nip shaft to control the suitable single weight, and dried in the oven , remove the solvent, and prepare the dielectric substrate layer. Overlap one or more dielectric substrate layers, with copper foil on the upper and lower sides, vacuum lamination and curing in a press for 60-120min, and the curing pressure is 25-50Kg / cm 2 , The curing temperature is 180-220 ° C, and the copper-clad laminate is prepared.
[0115] In yet another aspect, the present disclosure provides a circuit comprising a printed circuit board according to the above.
[0116] In yet another aspect, th...
Embodiment 1
[0126] 20g of polybutadiene resin B1000, 5g of styrene-butadiene-styrene block copolymer D1118, 4g of ethylene propylene elastomer Trilene 67, 1g of maleic anhydride polybutadiene resin Ricon130MA8, 1g 2,3-dimethyl-2,3 diphenylbutane Perkadox 30, 12g brominated flame retardant BT-93W, 70g inorganic filler DQ2028L, dissolved in toluene solvent, and adjusted to a viscosity of 50 seconds (using No. 4 viscosity cup test). Soak the glue with 1078 glass fiber cloth, pass the clamping shaft to control the unit weight to 190g, and dry the sheet in an oven to remove the toluene solvent to obtain 1078 prepreg. Overlap 6 sheets of 1078 prepreg, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in a press for 90 minutes, and the curing pressure is 25Kg / cm 2 , the curing temperature is 180°C, and a copper-clad laminate is prepared. The composition and amount of the dielectric substrate layer of the copper-clad laminate, the thickness of the copp...
Embodiment 2-16 and comparative example 1-16
[0128] Prepare the respective dielectric substrates and copper-clad laminates of Examples 2-16 and Comparative Examples 1-16 in the same manner as in Example 1, except that the composition and amount of the dielectric substrate layer of the copper-clad laminate and the copper foil The thickness of the layer, the roughness of the rough surface, the content of iron, nickel, cobalt and molybdenum, the amount of filler and the physical properties of the copper clad laminate are shown in Table 2-5 respectively. In Table 2-5, the unit of the components of the dielectric substrate layer including the filler is gram.
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