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A crystal ingot stripping method with ultrasonic and laser

A crystal ingot and laser technology, applied to laser welding equipment, manufacturing tools, welding equipment, etc., can solve the problems of low processing efficiency, large equipment footprint, scattered ingot stripping process, etc., to improve processing efficiency and reduce The effect of low floor space and low hardware cost

Active Publication Date: 2022-05-03
SONGSHAN LAKE MATERIALS LAB +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a crystal ingot stripping method with ultrasonic and laser, through the introduction of ultrasonic vibration, the synergistic effect is played while the laser is processing the crystal ingot, which solves the problems of scattered process of crystal ingot stripping, low processing efficiency and equipment occupation. The problem of large areas

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  • A crystal ingot stripping method with ultrasonic and laser
  • A crystal ingot stripping method with ultrasonic and laser
  • A crystal ingot stripping method with ultrasonic and laser

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] This embodiment provides a crystal ingot stripping method with ultrasonic cooperative laser, specifically:

[0059] Workers or robots fix the crystal ingot 6 on the fixture of the precision motion platform 8 in advance, move the crystal ingot 6 along the X-axis and Y-axis, determine the initial processing position of the crystal ingot 6 on the X-axis and Y-axis, and process the laser The laser beam 5 of the system is focused on a plane 400 μm away from the upper surface of the ingot 6 to determine the initial processing position of the ingot 6 on the Z axis. Starting from the initial processing position, use the laser beam 5 with a pulse width of 300fs, a wavelength of 1064nm, a power of 2W, and a repetition rate of 150kHz to follow the preset linear processing trajectory and move at a speed of 200mm / s. At the same time, the ultrasonic vibrator is turned on and vibrates along the XY plane. , the vibration frequency is 200Hz, and the vibration direction forms an included...

Embodiment 2

[0061] This embodiment provides a crystal ingot stripping method with ultrasonic cooperative laser, specifically:

[0062] Workers or robots fix the crystal ingot 6 on the fixture of the precision motion platform 8 in advance, move the crystal ingot 6 along the X-axis and Y-axis, determine the initial processing position of the crystal ingot 6 on the X-axis and Y-axis, and process the laser The laser beam 5 of the system is focused on a plane 250 μm away from the upper surface of the ingot 6 to determine the initial processing position of the ingot 6 on the Z axis. Starting from the initial processing position, use the laser beam 5 with a pulse width of 10ps, a wavelength of 1030nm, a power of 5W, and a repetition rate of 120kHz to move according to the preset linear processing trajectory at a speed of 200mm / s, and at the same time turn on the ultrasonic vibrator and vibrate along the XY plane , the vibration frequency is 300Hz, the vibration direction and the processing track...

Embodiment 3

[0064] This embodiment provides a crystal ingot stripping method with ultrasonic cooperative laser, specifically:

[0065] Workers or robots fix the crystal ingot 6 on the fixture of the precision motion platform 8 in advance, move the crystal ingot 6 along the X-axis and Y-axis, determine the initial processing position of the crystal ingot 6 on the X-axis and Y-axis, and process the laser The laser beam 5 of the system is focused on a plane 400 μm away from the upper surface of the ingot 6 to determine the initial processing position of the ingot 6 on the Z axis. Starting from the initial processing position, use the laser beam 5 with a pulse width of 6ns, a wavelength of 1064nm, a power of 2W, and a repetition rate of 100kHz to process the trajectory according to the preset curve, move at a speed of 120mm / s, and simultaneously turn on the ultrasonic vibrator and vibrate along the XY plane , the vibration frequency is 350Hz, the vibration direction and the processing track f...

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Abstract

The invention discloses a method for peeling off an ingot with ultrasonic synergistic laser, which relates to the technical field of wafer cutting. The XY plane vibrates; after the laser beam moves according to the processing trajectory, the laser processing system is turned off; the ingot is rotated around the Z axis, and the ultrasonic vibrator continues to vibrate along the XY plane until the crack is fully expanded along the XY plane and then shuts down. The ultrasonic vibrator was used to obtain the exfoliated ingot. The invention mainly solves the problem that the separate processing of two different laser stations not only causes high hardware cost, but also disperses each process, increases the area of ​​the equipment and reduces the processing efficiency; the invention realizes a single laser processing station The process of ingot stripping is completed, the hardware cost is low, the processing technology is highly integrated, the processing efficiency is improved, and the floor area of ​​the equipment is reduced.

Description

technical field [0001] The invention relates to the technical field of wafer cutting, in particular to a crystal ingot stripping method with ultrasound and laser. Background technique [0002] Ingot stripping is the main way to obtain wafers, and the quality and efficiency of ingot stripping are crucial factors affecting chip manufacturing; at present, the methods of ingot stripping mainly include contact tool cutting and laser processing. [0003] The publication number is CN103302754A, and the Chinese invention patent named Diamond Wire Saw Cutting Method and Cutting Equipment discloses a typical contact tool cutting crystal ingot method, which uses a circular diamond wire saw to cut crystal ingots, by increasing the line speed and changing the processing time. The unique contact method improves the cutting efficiency. However, for hard, brittle and difficult-to-machine materials such as crystal ingots, the processing cost of diamond tools is high, and the consumption of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402H01L21/301H01L21/302
CPCB23K26/38B23K26/402H01L21/30H01L21/302
Inventor 王宏建赵卫朱建海沈旋何自坚申漫漫
Owner SONGSHAN LAKE MATERIALS LAB