Water-based conductive adhesive and preparation method thereof

A conductive adhesive, water-based technology, applied in the field of conductive adhesive, can solve the problems of inapplicability, connection of sensitive electronic components and bioelectronic applications, limitation of the application range of conductive adhesive, and poisonous conductive adhesive, and achieve high conductivity and high The effect of adhesion ability and large ductility

Active Publication Date: 2020-11-20
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the conductive adhesive contains toxic and harmful solvents or requires special adhesive conditions (heating or light); in addition, the base material of the conductive adhesive is mostly rubber or silicone rubber, etc., which limits the application of the conductive adhesive range, especially not suitable for the connection of flexible, sensitive electronic components and bioelectronic applications

Method used

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  • Water-based conductive adhesive and preparation method thereof
  • Water-based conductive adhesive and preparation method thereof
  • Water-based conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Preparation of conductive adhesive: Take 100g of polyvinyl alcohol, 1000g of citric acid, 950g of sorbitol and 50g of PEDOT:PSS and add them to 8000g of water respectively, fully stir and dissolve, transfer the mixed solution into a mold and heat and dry at 60 degrees Celsius. Utilize the conductive adhesive obtained in this embodiment to be coated on different substrates of copper (Cu), aluminum (Al), PE, PI, PET, TPU, PEEK, PDMS, PTFE to test the adhesion, and the conductive adhesive on each substrate Adhesion as figure 1 shown, from figure 1 It can be seen that the conductive adhesive can be stably bonded on different substrate materials.

[0061] Other conditions remain the same, only the mass fraction of PEDOT:PSS is changed, and the mass fraction of PEDOT:PSS is 1%, 5%, 10%, 15%, 20%, 30% and 50%, respectively, to obtain conductive adhesives with different conductivity, and the obtained The conductivity of the conductive adhesive is as figure 2 shown.

Embodiment 2

[0063] Preparation of conductive adhesive: Take 50g of polyacrylic acid, 1000g of malic acid, 900g of pentaerythritol and 50g of PEDOT:PSS and add them to 8000g of water respectively, fully stir and dissolve, transfer the mixed solution into a mold and heat and dry at 60 degrees Celsius.

[0064] Other conditions remain the same, only the mass fraction of PEDOT:PSS is changed, and the mass fraction of PEDOT:PSS is 1%, 5%, 10%, 15%, 20%, 30% and 50%, respectively, to obtain conductive adhesives with different conductivity, and the obtained The conductivity of the conductive adhesive is as image 3 shown.

Embodiment 3

[0066] Preparation of conductive adhesive: Take 100g of polyvinyl alcohol, 1000g of tartaric acid, 650g of cyclodextrin and 50g of PEDOT:PSS and add them to 8000g of water respectively, fully stir and dissolve, transfer the mixed solution into a mold and heat and dry at 60 degrees Celsius.

[0067] Other conditions remain the same, only the mass fraction of PEDOT:PSS is changed, and the mass fraction of PEDOT:PSS is 1%, 5%, 10%, 15%, 20%, 30% and 50%, respectively, to obtain conductive adhesives with different conductivity, and the obtained The conductivity of the conductive adhesive is as Figure 4 shown.

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Abstract

The invention discloses a water-based conductive adhesive and a preparation method thereof. The conductive adhesive is prepared from the following components: 1%-20% of water-soluble polymer, 40%-98%of an additive, and 1%-59% of a conductive material, wherein the additive is a supermolecule with hydrogen bond interaction. The conductive adhesive disclosed by the invention has high conductivity, large ductility and high adhesion capacity; and meanwhile, the conductive adhesive can be used as an electronic bonding material, and stable adhesion on different substrate materials can be achieved, and the substrate types comprise any one of the following types: metal (gold, silver, copper, aluminum, zinc and the like), polymer plates (PMMA and POC), films (PI, PET, PS, PEEK, PTFE, TPU, PE and the like), paper, wood and the like. In addition, the environment-friendly adhesive material and the conductive material are compounded, so that the conductive adhesive without toxic solvents is obtained.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a water-based conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesives can be used as electrode connections or conductive coatings in flexible electronic devices, wearable devices, and bioelectronic devices, which have important application value. Among them, the high conductivity, ductility and interface viscosity of conductive adhesive are the key technical indicators for its research and application. [0003] In the existing technology, the conductive adhesive contains toxic and harmful solvents or requires special adhesive conditions (heating or light); in addition, the base material of the conductive adhesive is mostly rubber or silicone rubber, etc., which limits the application of the conductive adhesive range, especially not suitable for the connection of flexible, sensitive electronic components and bioelectro...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J129/04C09J133/02C09J11/06C09J11/08
CPCC09J9/02C09J129/04C09J133/02C09J11/06C09J11/08C08L2205/03C08L2205/035C08K2201/001C08L65/00C08L25/18C08K5/092C08K5/1545C08K5/053C08L5/16
Inventor 周学昌谭鹏王海飞宋华峰陆喜甘田生
Owner SHENZHEN UNIV
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