Silicon carbide micro-powder iron removal device for semiconductor

Abstract

The invention discloses a silicon carbide micro-powder iron removal device for a semiconductor. The silicon carbide micro-powder iron removal device comprises a main box body, wherein an air pump is fixedly mounted on one side in the main box body; a motor is fixedly mounted on one side, close to the air pump, in the main box body; a speed reducer is fixedly mounted on the other side, close to themotor, of the main box body; an input shaft of the speed reducer is in transmission connection with the motor through a coupler; a cam is fixedly mounted on an output shaft of the speed reducer; a connecting rod is fixedly mounted at the other end of the cam; a screening box body is fixedly installed at the other end of the connecting rod; an air blowing hole is formed in the side wall in the screening box; an electromagnet is fixedly installed at the top part of the screening box; a first discharging port is formed in one side of the exterior of the main box; a second discharging port is formed in the side, away from the first discharging port, of the exterior of the main box body; and a feeding port is formed in the top part of the main box body. The silicon carbide micro-powder iron removal device for the semiconductor is simple and reasonable in structure and convenient to use, iron removal of silicon carbide micro-powder is effectively achieved, and high practical value is achieved.

Description

technical field [0001] The invention relates to the technical field of silicon carbide micropowder processing, in particular to a silicon carbide micropowder iron removal device for semiconductors. Background technique [0002] Silicon carbide powder refers to micron-sized silicon carbide powder that is ultrafinely crushed and classified by JZFZ equipment. Silicon carbide powder is mainly 1200# and 1500#. Since silicon carbide powder is mainly used in the abrasive industry, the classification of the powder There are special requirements that no large particles can appear in the micropowder, so in order to meet the requirements of international and domestic products, JZF grading equipment is generally used for high-precision classification in general production. Domestic silicon carbide micropowders are mainly black silicon carbide micropowder and green silicon carbide micropowder. [0003] The existing silicon carbide powder will be mixed with some iron powder during the pro...

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Problems solved by technology

[0003] The existing silicon carbide powder will be mixed with some iron powder during the production process, so in order to ensure the performance of silicon carbide powder, iron powder needs to be removed, and currently the iron removal of silicon carbide powder is mainly carried out by chemical methods. Add water to the silicon carbide powder mixed with iron powder to make a slurry, and mix it by stirring to make it evenly dispersed in water, then add acidic solvents such as sulfuric acid or hydrochloric acid, and use the acidic solvent to react chemically with iron powder without chemical reaction with silicon carbide properties to achieve the purpose of removing iron from silicon carbide micropowder, but this method consumes a large amount of production auxiliary materials such as sulfuric acid or hydrochloric acid, which increases the production cost of silicon carbide powder. In addition, there is a large amount of acid wastewater in the process of using sulfuric acid or hydrochloric acid. produced, causing harm to the ecological environment, high production costs, low iron removal efficiency, and unable to meet actual use needs

Another method of removing iron through magnets effectively solves the disadvantages of chemical methods, but it is inconvenient to clean up iron-containing substances. Therefore, we have improved this and proposed a silicon carbide micro-powder iron removal device for semiconductors.

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