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High-temperature-resistant release film and preparation method thereof

A release film, high temperature resistant technology, used in chemical instruments and methods, other household appliances, electronic equipment, etc., can solve the problems of easy wrinkling during the pressing process, unfavorable recycling of fluorine-containing materials and environmental protection, and achieve low thermal shrinkage. rate, high resistance glue, high release effect

Pending Publication Date: 2020-11-27
NINGBO CHANGYANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, fluorine-containing materials are not conducive to recycling and environmental protection, and are prone to wrinkles during the pressing process. In recent years, they have been replaced by PMP-type release films.

Method used

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  • High-temperature-resistant release film and preparation method thereof
  • High-temperature-resistant release film and preparation method thereof
  • High-temperature-resistant release film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0021] The preparation method of the high temperature resistant release film provided by the invention comprises the following steps:

[0022] Put 100% PMP into A twin-screw extruder, and put into B twin-screw extruder the mixture of COC, PP, and POE-g-MAH according to the ratio, and perform melt plasticization and melt filtration respectively. T-shaped die head, cooling film forming, tempering, winding, slitting and packaging.

[0023] Further, the temperature of each zone of the A twin-screw extruder is 230-270°C. The filter mesh has a pore size of 10-15 μm. The temperature in each zone of the B twin-screw extruder is 220-260°C. The filter mesh has a pore size of 10-15 μm. Die temperature was 260-280°C. Casting speed is 30-50m / min. The tempering roll temperature is 70-120°C.

[0024] The structural diagram of the release film is shown in figure 1 , A is the release layer, and B is the resist layer.

[0025] The test method of the performance of reflective polyester f...

Embodiment 1

[0032] The proportion of release layer A is 100% RT18. The proportion of layer B of the adhesive barrier layer is 50% 6015, 45% PP (MFR = 1g / 10min), 5% POE-g-MAH. The total thickness of the release film is 110 μm, the thickness of layer A is 40 μm, and the thickness of layer B is 70 μm. The relevant properties are shown in Table 1.

Embodiment 2

[0034] The proportion of release layer A is 100% RT18. The proportion of layer B of the adhesive barrier layer is 55% 6015, 50% PP (MFR=2g / 10min), 5% POE-g-MAH. The total thickness of the release film is 120 μm, the thickness of layer A is 40 μm, and the thickness of layer B is 80 μm. The relevant properties are shown in Table 1.

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Abstract

The present invention provides a release film containing a 4-methyl-1-pentene copolymer. The release film is composed of a layer A and a layer B, wherein the layer A is a release layer, and the layerB is a glue blocking layer. The release film is high in release performance, low in heat shrinkage rate and high in glue blocking performance. The release film is obtained by a co-extrusion forming method, and the preparation method is simple.

Description

technical field [0001] The invention relates to a film comprising 4-methyl-1-pentene copolymer (PMP), which is mainly used as a release film in the lamination process of a flexible printed circuit board (FPC), which has high release properties and low heat The shrinkage rate and high glue resistance belong to the field of polymer compound materials. Background technique [0002] Flexible printed circuit board (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide (PI) as the base material. It has high wiring density, light weight and thin thickness. specialty. It is mainly used in many products such as mobile phones, notebook computers, PDAs, and digital cameras. [0003] The manufacturing process for FPC is usually heat-cured adhesive to bond the copper foil and PI film that form the circuit. During the bonding process, the substrate and the PI film with curing agent need to be sandwiched in a metal plate to be heated and pressurized fo...

Claims

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Application Information

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IPC IPC(8): B32B27/30B32B27/32B32B27/08B32B3/30C08L45/00C08L23/12C08L51/06C08J5/18B29C48/08B29C48/18
CPCB32B27/30B32B27/32B32B27/08B32B3/30C08L45/00C08L23/12C08J5/18B29C48/08B29C48/18C08L2205/03C08L2203/16C08J2345/00C08J2323/12C08J2323/20B32B2457/08B32B2307/30B32B2307/538C08L51/06
Inventor 金亚东杨承翰周玉波朱正平
Owner NINGBO CHANGYANG TECH
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