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Preparation method of lead-tin-based solder alloy and prepared solder alloy

A solder alloy and lead-tin technology, which is applied in the field of preparation of lead-tin-based solder alloys, can solve problems such as high melting point and damage to electronic components, and achieve the effects of low energy consumption, improved wetting performance, and high efficiency

Active Publication Date: 2020-11-27
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the melting point of the aluminum alloy solder for copper-aluminum welding prepared in the prior art is 500°C to 580°C, which is relatively high, and it is easy to cause damage to electronic components during the welding process.

Method used

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  • Preparation method of lead-tin-based solder alloy and prepared solder alloy
  • Preparation method of lead-tin-based solder alloy and prepared solder alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Method for preparing lead-tin-based solder alloy by spark plasma sintering

[0031] (1) Flour making: the following raw materials are mixed in percentage by weight: Sn powder 52%, Pb powder 30%, In powder 15%, Bi powder 1.5%, Tb powder 0.02%, Zr powder 0.1%, Fe powder 0.7%, remaining The amount is Se powder, put the above powder in a vacuum ball mill tank, and stir and mix at 300r / min for 300min;

[0032] (2) Sintering: put the powder mixed in step (1) into the graphite mold, pre-press the powder, the pre-compression pressure is 5Mpa, after adjusting the position, put the graphite mold with the powder into the SPS furnace cavity , vacuumed to 10 -1 Pa, the sintering pressure is 50Mpa, the heating rate is 45°C / min, the temperature is raised to 520°C and then kept for 5 minutes, and the lead-tin-based solder alloy is obtained after cooling with the furnace. figure 1 It is a scanning electron microscope image of the solder alloy prepared in this embodiment, and it can be...

Embodiment 2

[0034] Method for preparing lead-tin-based solder alloy by spark plasma sintering

[0035] (1) Milling: the following raw materials are mixed in weight percentage: Sn powder 47%, Pb powder 35%, In powder 15%, Bi powder 2%, Tb powder 0.02%, Zr powder 0.1%, Fe powder 0.7%, surplus The amount is Se powder, put the above powder in a vacuum ball mill tank, and stir and mix at 300r / min for 300min;

[0036] (2) Sintering: Put the powder mixed in step (1) into a graphite mold, pre-press the powder, the pre-press pressure is 5Mpa, place the pre-pressed mold in a discharge plasma sintering furnace, and vacuum to 10 -1 Pa, the sintering pressure is 50Mpa, the heating rate is 45°C / min, the temperature is raised to 520°C and then kept for 5min, and the lead-tin-based solder alloy is obtained after cooling with the furnace.

Embodiment 3

[0038] Method for preparing lead-tin-based solder alloy by spark plasma sintering

[0039] (1) Milling: the following raw materials are mixed in weight percentage: Sn powder 55%, Pb powder 25%, In powder 15%, Bi powder 2%, Tb powder 0.02%, Zr powder 0.1%, Fe powder 0.7%, surplus The amount is Se powder, put the above powder in a vacuum ball mill tank, and stir and mix at 300r / min for 300min;

[0040] (2) Sintering: Put the powder mixed in step (1) into a graphite mold, pre-press the powder, the pre-press pressure is 5Mpa, place the pre-pressed mold in a discharge plasma sintering furnace, and vacuum to 10 -1 Pa, the sintering pressure is 50Mpa, the heating rate is 45°C / min, the temperature is raised to 520°C and then kept for 5min, and the lead-tin-based solder alloy is obtained after cooling with the furnace.

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Abstract

The invention discloses a preparation method of a lead-tin-based solder alloy. The preparation method comprises the following steps that (1), powder preparing is carried out, specifically, the following raw material of, in percentage by weight, 45-60% of Sn powder, 25-35% of Pb powder, 10-25% of In powder, 1.5-5% of Bi powder, 0.02-0.08% of Tb powder, 0.1-0.7% of Zr powder, 0.7% of Fe powder and the balance of Se powder are mixed; and (2), sintering is carried out, specifically, the mixed powder is put into a graphite mold, pre-pressing is carried out, the pre-pressed mold is put into a sparkplasma sintering furnace, vacuumizing is carried out, the sintering pressure is 50 Mpa, the heating rate is 45 DEG C / min, the temperature is raised to 520 DEG C, then heat preservation is carried outfor 5 min, and after furnace cooling, lead-tin-based solder alloy is prepared. The invention further provides the solder alloy prepared by the preparation method. The lead-tin-based solder alloy has the beneficial effects that the microstructure of the lead-tin-based solder alloy is uniform and compact, the wettability of the solder alloy is improved, and the lead-tin-based solder alloy has a lowmelting point.

Description

technical field [0001] The invention relates to the technical field of solder alloys, in particular to a preparation method of a lead-tin-based solder alloy and the prepared solder alloy. Background technique [0002] In the field of electronic goods manufacturing, soldering is a very important process, in order to obtain excellent solder joints, the choice of solder is also critical. Solder is a general term for metallic materials that are added to welds, weld layers, and brazing joints. It mainly includes welding wire, solder, welding rod and so on. There are many types of solder, and those with different components can be divided into lead-tin solder, copper solder, silver solder, etc., and can be divided into soft solder and hard solder according to the melting point. Lead-tin solder is mostly used now, lead-tin alloy solder is used for soldering of the wire ends of A, B, and E insulation levels, and pure tin solder is used for F and H levels. Solder's melting point t...

Claims

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Application Information

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IPC IPC(8): C22C13/00C22C30/04C22C1/04B22F3/105B23K35/26
CPCB22F3/105B22F2003/1051B23K35/262C22C1/0483C22C13/00C22C30/04
Inventor 李明荣毛亮王志海鲍睿时海涛钱江蓉胡峰于坤鹏邵世东魏李
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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