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Method for producing a printed wiring board

A printed circuit board and process technology, which is applied in the field of printed circuit board preparation, can solve the problems of not being able to fully ensure the adhesion between the resin substrate and the coating film, and achieve the effects of good penetration, excellent coating adhesion, and stable treatment solution

Pending Publication Date: 2020-12-01
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the high functionality and high integration of printed circuit boards, there have been problems such as that the conventional desmear treatment cannot sufficiently ensure the adhesion between the resin substrate and the coating (hereinafter, also simply referred to as "coating adhesion").

Method used

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  • Method for producing a printed wiring board
  • Method for producing a printed wiring board
  • Method for producing a printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083]Here, samples were prepared in accordance with the procedures shown in Table 1 and Table 2, and the usefulness of the first A process (ultraviolet irradiation) and the second process specified in the present invention were investigated.

[0084]Using a resin substrate laminated with insulating resin (GL102) manufactured by Ajinomoto Fine Chemicals Co., Ltd., as shown in Table 1, the wavelength and irradiation time of the ultraviolet rays were changed variously, and ultraviolet rays were irradiated. For comparison, a sample that was not irradiated with ultraviolet rays was also prepared. Heat treatment (15 minutes at 160°C) was performed as needed.

[0085]The resin surface roughness Ra at this time is shown in Table 3. Ra was measured using a laser microscope (Contour GT-X) manufactured by Bruker.

[0086]It should be noted that the details of the second step (the glycol ether and the silane coupling agent are also collectively referred to as "treatment liquid") are shown in Table 1, a...

Embodiment 2

[0119]Here, samples were prepared according to the steps shown in Table 4 and Table 5, and the usefulness of the first B step (change of the desmear treatment) and the second step specified in the present invention was investigated.

[0120]The conditions of the 1B step and the details of the treatment liquid used in the second step are shown in Table 4. Table 4 shows the concentration of glycol ether and silane coupling agent in the treatment liquid of each No.

[0121]The pH of the above-mentioned treatment liquid was as shown in Table 4, and no pH adjuster was added.

[0122]For comparison, a sample with no silane coupling agent added was also prepared.

[0123]In this example, a sample was produced in the same manner as in Example 1 above, except that the sample was produced according to the steps shown in Table 5, and various characteristics were evaluated.

[0124]These results are shown in Table 6. The resin surface roughness Ra shown in Table 6 was measured after the 1B step and before the...

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Abstract

A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 mum or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B;and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating. The step 1A comprises a step of irradiating the surface of the resin substrate with ultraviolet light having a wavelength of 350 nm or less so as to have a surface roughness Ra of 0.2 [mu]m or less; the step 1B comprises steps that the resin substrate is sequentially swollen, roughened at 50-70 DEG C for 1-10 minutes, and neutralized to have a surface roughness Ra of 0.2 [mu]m or less; the step 2 comprises steps that a silane coupling agent having an amino group, and ethylene glycol butyl ether represented by C4H9-(OC2H4)n-OH (n is an integer of 1-4) and / or propylene glycol butyl ether represented by C4H9-(OC3H6)n-OH (n is an integer of 1-4) are used to treat at a pH of 3-10.

Description

Technical field[0001]The invention relates to a method for preparing a printed circuit board.Background technique[0002]Printed circuit boards commonly used in the fields of electronic equipment, such as copper plating to prepare printed circuit boards, for example, resin substrates are usually swelled and roughened (dipped in a roughening solution containing an oxidant Etching the surface of the resin substrate), reduction treatment (neutralization treatment) for reducing oxides generated in the roughening treatment, (ultrasonic treatment, cleaning treatment as needed), drying, soft etching, pickling, catalyst application, Prepared by electroless copper plating and electrolytic copper plating. The above-mentioned roughening liquid is also called a desmear liquid, and is used to remove multiple holes provided on a printed circuit board (for example, used to connect blind holes or through holes between multiple conductors, or used to form a circuit). The formation of grooves, etc.) in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/20C23C18/22H05K3/18H05K3/24
CPCC23C18/204C23C18/22C23C18/2033H05K3/181H05K3/24H05K2203/072C25D7/123C23C18/38C23C18/2086C25D5/50C25D5/56C25D3/38H05K2203/0307H05K2203/0285H05K3/389H05K2203/1105H05K3/387H05K3/0055H05K3/002H05K2203/111C23C18/2046
Inventor 西条义司山本久光仲宣彦
Owner C UYEMURA & CO LTD