Manufacturing method of N-type crystalline silicon solar cell and manufacturing method of passivated contact structure on back surface of N-type crystalline silicon solar cell
A manufacturing method and a technology of a contact structure, applied in the field of solar cells, can solve problems such as uneven polysilicon thin layers on the surface of silicon wafers, poor-quality oxide layers, and affecting the quality of tunneling oxide passivation layers, so as to avoid bad oxide layers, The effect of ensuring quality and improving conversion efficiency
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Embodiment 1
[0039]A method for making a passivation contact structure, using such as figure 1 The shown furnace tube grows, and the interior of the furnace tube is provided with a partition 20 parallel to its own axis. The air vent with the opening and closing function specifically includes the following steps:
[0040] S1: Send the N-type crystalline silicon substrate into the reaction chamber 40 of the diffusion furnace tube, first feed nitrogen gas at a flow rate of 10 slm, adjust the nitrogen gas flow rate, then feed nitrogen gas at a flow rate of 20 slm and perform the first vacuum pumping for 30 minutes, and then vacuumize After the stop, continue to feed nitrogen, feed nitrogen at a flow rate of 20slm for 10 minutes, then feed nitrogen at a flow rate of 1slm for 20 minutes, and raise the temperature to the preset temperature of 580°C under a nitrogen atmosphere, and vacuumize for the second time for 3 minutes. After the temperature stabilized for about 3 minutes, oxygen was introd...
Embodiment 2
[0043] A method for making a passivation contact structure, using such as figure 1 The shown furnace tube grows, and the interior of the furnace tube is provided with a partition 20 parallel to its own axis. The opening and closing function of the exhaust hole specifically includes the following steps:
[0044] S1: Send the N-type crystalline silicon substrate into the reaction chamber 40 of the diffusion furnace tube, first feed nitrogen gas at a flow rate of 15 slm, adjust the nitrogen gas flow rate, then feed nitrogen gas at a flow rate of 30 slm and perform the first vacuum pumping for 20 minutes, and then vacuumize After stopping, continue to feed nitrogen, feed nitrogen at a flow rate of 30slm for 8 minutes, then feed nitrogen at a flow rate of 3slm for 15 minutes, and raise the temperature to the preset temperature of 600°C under a nitrogen atmosphere, and vacuumize for the second time for 3 minutes. After the temperature is stabilized for about 3 minutes, oxygen is in...
Embodiment 3
[0047] A method for making a passivation contact structure, using such as figure 1 The shown furnace tube grows, and the interior of the furnace tube is provided with a partition 20 parallel to its own axis. The air vent with the opening and closing function specifically includes the following steps:
[0048] S1: Send the N-type crystalline silicon substrate into the reaction chamber 40 of the diffusion furnace tube, first feed nitrogen gas at a flow rate of 20 slm, adjust the flow rate of nitrogen gas, then feed nitrogen gas at a flow rate of 50 slm and perform the first vacuum pumping for 10 minutes, and then vacuumize After stopping, continue to feed nitrogen gas, feed nitrogen gas at a flow rate of 50 slm for 5 minutes, and then feed nitrogen gas at a flow rate of 5 slm for 10 minutes, and raise the temperature to the preset temperature of 650 ° C under a nitrogen atmosphere, and vacuumize for the second time for 3 minutes. After the temperature stabilized for about 3 min...
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