A kind of manufacturing method of n-type crystalline silicon solar cell and the manufacturing method of back passivation contact structure thereof
A manufacturing method and a technology of a contact structure, applied in the field of solar cells, can solve problems such as poor quality oxide layers, uneven polysilicon thin layers on the surface of silicon wafers, and affecting the quality of tunnel oxide passivation layers, so as to ensure quality and avoid defects Oxide layer, effect of improving conversion efficiency
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Embodiment 1
[0039]A method for making a passivation contact structure, using such as figure 1 The shown furnace tube grows, and the interior of the furnace tube is provided with a partition 20 parallel to its own axis. The air vent with the opening and closing function specifically includes the following steps:
[0040] S1: Send the N-type crystalline silicon substrate into the reaction chamber 40 of the diffusion furnace tube, first feed nitrogen gas at a flow rate of 10 slm, adjust the nitrogen gas flow rate, then feed nitrogen gas at a flow rate of 20 slm and perform the first vacuum pumping for 30 minutes, and then vacuumize After the stop, continue to feed nitrogen, feed nitrogen at a flow rate of 20slm for 10 minutes, then feed nitrogen at a flow rate of 1slm for 20 minutes, and raise the temperature to the preset temperature of 580°C under a nitrogen atmosphere, and vacuumize for the second time for 3 minutes. After the temperature stabilized for about 3 minutes, oxygen was introd...
Embodiment 2
[0043] A method for making a passivation contact structure, using such as figure 1 The shown furnace tube grows, and the interior of the furnace tube is provided with a partition 20 parallel to its own axis. The opening and closing function of the exhaust hole specifically includes the following steps:
[0044] S1: Send the N-type crystalline silicon substrate into the reaction chamber 40 of the diffusion furnace tube, first feed nitrogen gas at a flow rate of 15 slm, adjust the nitrogen gas flow rate, then feed nitrogen gas at a flow rate of 30 slm and perform the first vacuum pumping for 20 minutes, and then vacuumize After stopping, continue to feed nitrogen, feed nitrogen at a flow rate of 30slm for 8 minutes, then feed nitrogen at a flow rate of 3slm for 15 minutes, and raise the temperature to the preset temperature of 600°C under a nitrogen atmosphere, and vacuumize for the second time for 3 minutes. After the temperature is stabilized for about 3 minutes, oxygen is in...
Embodiment 3
[0047] A method for making a passivation contact structure, using such as figure 1 The shown furnace tube grows, and the interior of the furnace tube is provided with a partition 20 parallel to its own axis. The air vent with the opening and closing function specifically includes the following steps:
[0048] S1: Send the N-type crystalline silicon substrate into the reaction chamber 40 of the diffusion furnace tube, first feed nitrogen gas at a flow rate of 20 slm, adjust the flow rate of nitrogen gas, then feed nitrogen gas at a flow rate of 50 slm and perform the first vacuum pumping for 10 minutes, and then vacuumize After stopping, continue to feed nitrogen gas, feed nitrogen gas at a flow rate of 50 slm for 5 minutes, and then feed nitrogen gas at a flow rate of 5 slm for 10 minutes, and raise the temperature to the preset temperature of 650 ° C under a nitrogen atmosphere, and vacuumize for the second time for 3 minutes. After the temperature stabilized for about 3 min...
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