Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of epoxy resin curing agent composition and preparation method thereof, a kind of epoxy resin composition

A technology of epoxy resin curing and epoxy resin, applied in the field of epoxy resin curing agent composition and its preparation, and epoxy resin composition, can solve the problems of inability to improve curing reactivity and crosslinking density, and achieve good durability Thermal properties, increasing crosslink density, improving fracture toughness and elongation at break

Active Publication Date: 2022-08-02
WANHUA CHEM GRP CO LTD +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Patent CN101906206A uses the adduct of 1-(aminoalkyl) imidazole and isocyanate as the curing agent of epoxy adhesive, which can realize the rapid curing of the adhesive system; however, the 1-position of 1-(aminoalkyl) imidazole can be The active hydrogen that reacts with the epoxy group is replaced by an alkylamino group. In addition, the adduct is a two-functional 1-(aminoalkyl) imidazole-blocked isocyanate molecular structure, so the curing agent molecule cannot pass through the excess active hydrogen and Multifunctional structure further improves curing reactivity and crosslink density

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of epoxy resin curing agent composition and preparation method thereof, a kind of epoxy resin composition
  • A kind of epoxy resin curing agent composition and preparation method thereof, a kind of epoxy resin composition
  • A kind of epoxy resin curing agent composition and preparation method thereof, a kind of epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 1) Add the IPDI trimer slowly to the alkylamino imidazole (2-imidazolyl-2-yl-propyl) amine at room temperature (molar ratio is 1:3), and the dropping rate is 1 drop / s, After the dropwise addition, the reaction was continued for 0.5 hours, and the reaction temperature was 20° C. to obtain the (2-imidazolyl-2-yl-propyl)amine-terminated IPDI trimer; (2) adding the obtained in (1) Epoxy resin (10wt%) and IPDA (90wt%) were mixed at 20°C to obtain a high toughness medium temperature rapid curing system; (3) The rapid curing system prepared above was mixed with epoxy resin E51 (mass ratio of 30:100) in Mixing evenly at 20°C can obtain a high toughness medium temperature fast curing epoxy resin system.

[0041] Wherein, the (2-imidazolyl-2-yl-propyl) amine-terminated IPDI trimer infrared spectrum obtained in step 1) is as follows figure 1 Shown: Measured by infrared, 1714cm -1 is the -C=O stretching vibration peak of urethane and isocyanurate, 1447cm -1 It is the ring vibrat...

Embodiment 2

[0044] 1) Slowly add HDI trimer (WANNATE HT-600) to alkylaminoimidazole (2-imidazolyl-2-yl-ethyl)amine at room temperature (molar ratio is 1:4), and the dropping rate is 2 drops / s, continue to react for 1 hour after the dropwise addition, the reaction temperature is 30 ° C, and the reaction obtains (2-imidazolyl-2-yl-ethyl)amine-terminated HDI trimer; (2) (2) 1) The adduct (20 wt %) obtained in 40° C. is mixed with diaminodicyclohexyl methane (WANAMINE HMDA) (80 wt %) to obtain a high-toughness medium-temperature fast curing system; (3) The above prepared The rapid curing system and epoxy resin E51 (mass ratio of 20:100) were mixed uniformly at 30°C to obtain a high toughness medium temperature rapid curing epoxy resin system.

[0045] Wherein, the (2-imidazolyl-2-yl-ethyl)amine-terminated HDI trimer infrared spectrum obtained in step 1) is as follows figure 2 Shown: Measured by infrared, 1457cm -1 is the characteristic peak of HDI trimer, 1680cm --1 C=O stretching vibrati...

Embodiment 3

[0048] 1) MDI dimer is slowly added dropwise (mol ratio is 1:2) in alkylamino imidazole (2-imidazolyl-2-yl-methyl)amine at room temperature, and the dropping rate is 3 drops / s, After the dropwise addition, the reaction was continued for 1.5 hours, and the reaction temperature was 40° C. to obtain a (2-imidazolyl-2-yl-methyl)amine-terminated MDI dimer; (2) adding the obtained in (1) (30wt%) and 1,3-cyclohexanedimethylamine (BAC) (70wt%) were mixed at 60℃ to obtain a high toughness medium temperature rapid curing system; (3) The rapid curing system prepared above was heated at 40℃ Evenly mixing with epoxy resin E51 (mass ratio of 10:100) at high temperature to obtain a high toughness medium temperature fast curing epoxy resin system.

[0049] Wherein, the infrared spectrum of the (2-imidazolyl-2-yl-methyl)amine-terminated MDI dimer obtained in step 1) is as follows image 3 Shown: Measured by infrared, 1776cm -1 -C=O stretching vibration peak of MDI dimer, 1716cm -1 is the -C...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an epoxy resin curing agent composition and a preparation method thereof. The curing agent composition comprises 2-alkylaminoimidazole-terminated diisocyanate oligomer, 10-30wt%, and liquid polyamine, 70-90wt%. The epoxy resin curing agent composition prepared by the present invention can be mixed with an epoxy resin to prepare an epoxy resin composition, which has a relatively low viscosity and can achieve rapid curing within 3 minutes at 110-120 degrees Celsius, and the cured product has a relatively low viscosity. High toughness and heat resistance. The epoxy resin composition of the present invention is suitable for resin transfer molding RTM, wet molding WCM, and resin matrix for infusion molding composite materials.

Description

technical field [0001] The invention belongs to the field of epoxy resin composite materials, and in particular relates to an epoxy resin curing agent composition and a preparation method thereof, which have the characteristics of high toughness, medium temperature and rapid curing, and also relates to the use of the epoxy resin curing agent combination. prepared epoxy resin composition. Background technique [0002] In recent years, many countries and regions in the world have formulated energy-saving and emission-reduction targets. my country has also made it clear that by 2020, the average fuel consumption of new passenger cars will reach 5L / 100km, and the pressure on energy-saving and emission reduction is great. Among the current energy-saving and emission-reduction paths, vehicle lightweighting is the easiest way to achieve and has relatively large potential. For passenger gasoline vehicles, for every 100kg reduction, up to 0.39L / 100km of fuel can be saved. On the oth...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50
CPCC08G59/5073C08G59/50
Inventor 刘大伟刘赵兴罗丛叶周萌
Owner WANHUA CHEM GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com