Microwave component circuit coupling transmission performance prediction method based on double-gold-strip bonding configuration
A technology of microwave components and transmission performance, which is applied in the fields of instruments, computing, and electrical digital data processing, etc., and can solve problems such as optimization and control of interconnection configuration parameters, inability to accurately predict signal transmission performance, and increased costs
Active Publication Date: 2020-12-15
XIDIAN UNIV
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Problems solved by technology
However, most of the current research on circuit interconnection is still at the level of relying on a large number of software simulations and manual experience. There is no model that can be quantitatively represented, and it is impossible to achieve accurate prediction of signal transmission performance and optimal control of interconnection configuration parameters, resulting in work efficiency. lower cost
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[0085] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0086] refer to figure 1 , the present invention is a method for predicting the coupling transmission performance of a microwave component circuit based on a double gold ribbon bonding configuration, and the specific steps are as follows:
[0087] Step 1. Determine the geometric parameters and physical parameters of the double gold ribbon bonding interconnection in the microwave component
[0088] refer to figure 2 and image 3 As shown, the double gold ribbon bonding interconnection in the high-frequency microwave component includes a ground plate, and a dielectric substrate 3 is connected on the upper layer of the ground plate 4, and the conductor ribbon 2 connected on the dielectric substrate 3 is connected through the double gold ribbon 1. According to the specific requirements of the interconnection in high-frequency microwave components, the g...
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The invention discloses a microwave component circuit coupling transmission performance prediction method based on a double-gold-strip bonding configuration. The method comprises the following steps:determining double-gold-strip bonding interconnection geometry, physical properties and electromagnetic transmission parameters; configuring a parameterized representation model; performing key band equivalence and inductive reactance calculation; performing piecewise discretization and linear equivalence; establishing an interconnection area segmented transmission line equivalent circuit; solvinga single transfer matrix, double admittance parameters, double scattering parameters and double gold strip bonding interconnection overall absorption loss; and establishing a double-gold-strip bonding interconnection configuration and signal transmission performance circuit coupling model. According to the method, accurate prediction from microwave interconnection structure morphological parameters to signal transmission performance can be achieved through the coupling model, high-performance microwave assembly design and optimization are guided, the microwave product development quality is effectively improved, the cost is saved, and the development period is shortened.
Description
technical field [0001] The invention belongs to the technical field of microwave radio frequency circuits, and specifically relates to a method for predicting the coupling and transmission performance of microwave components based on a double gold ribbon bonding configuration, which can be used to guide the optimization of circuit interconnection design and the regulation of electromagnetic transmission performance in microwave components. Background technique [0002] With the rapid development of microwave electronic technology, microwave circuits and components are playing an increasingly important role in chip integrated components, radar navigation detection, communication transmission technology and other aerospace fields. As one of the typical key components of electronic equipment, microwave components are facing more difficult challenges due to the increasingly urgent development requirements of high frequency, high precision and high reliability of modern electronic...
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IPC IPC(8): G06F30/367G06F30/373
CPCG06F30/367G06F30/373
Inventor 王从思田军李芮宁周轶江周澄刘菁王志海于坤鹏连培园薛松王艳刘少义严粤飞
Owner XIDIAN UNIV