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High-thermal-expansion glass powder for copper paste as well as preparation method and application of high-thermal-expansion glass powder

A high thermal expansion, glass powder technology, used in the field of conductive fillers, can solve problems such as inability to apply, and achieve the effects of short grinding time, uniform particle size distribution, and uniform discharge particle size distribution

Active Publication Date: 2020-12-25
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of glass for electronic paste is mostly used in the sealing of ceramic capacitors with small thermal expansion coefficients such as alumina, but it cannot be applied to magnesia ceramic substrates with high thermal expansion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A high thermal expansion glass powder for copper paste is provided, the components are BaO 55%, ZnO 19.5%, B 2 o 3 8%, Al 2 o 3 8%, CaO 5%, Fe 2 o 3 0.5%, SiO 2 1%, SrO 0.5%, SnO 2 1%, CoO0.5%, ZrO 2 0.5%, Bi 2 o 3 0.5%.

[0025] The preparation method of high thermal expansion glass powder for above-mentioned copper paste specifically comprises the following steps:

[0026] 1) According to the ratio of each oxide component in the above-mentioned glass powder, weigh 70.8g BaCO with an electronic balance 3 , 19.5g ZnO, 14.2g H 3 BO 3 , 8g Al 2 o 3 , 8.9g CaCO 3 , 0.5g Fe 2 o 3 , 1g SiO 2 , 0.7g SrCO 3 , 1.6g Sn(CO 3 ) 2 , 0.5g CoO, 0.5g ZrO 2 , 0.5g Bi 2 o 3 ; Put the weighed raw materials into a ball mill and grind and stir for 10 minutes until the glass raw materials are evenly mixed.

[0027] 2) Put the glass raw materials uniformly mixed in step 1) into a corundum crucible, raise the temperature to 1280°C at a rate of 10°C / min in a hig...

Embodiment 2

[0031] A high thermal expansion glass powder for copper paste is provided, the components are: BaO 52%, ZnO20.3%, B 2 o 3 9%, Al 2 o 3 7%, CaO 5%, Fe 2 o 3 0.5%, SiO 2 2%, SrO 2%, SnO 20.5%, CoO0.5%, ZrO 2 0.5%, Bi 2 o 3 0.7%.

[0032] The preparation method of high thermal expansion glass powder for above-mentioned copper paste specifically comprises the following steps:

[0033] 1) According to the distribution ratio of each oxide component in the above-mentioned glass powder, weigh 67g of BaCO with an electronic balance 3 , 20.3gZnO, 15.98gH 3 BO 3 , 7g Al 2 o 3 , 8.9g CaCO 3 , 0.5g Fe 2 o 3 , 2g SiO 2 , 2.85g SrCO 3 , 0.8g Sn(CO 3 ) 2 , 0.5g CoO, 0.5g ZrO 2 , 0.7g Bi 2 o 3 ; Put the weighed raw materials into a ball mill and grind and stir for 10 minutes until they are evenly mixed.

[0034] 2) Put the glass raw materials uniformly mixed in step 1) into an alumina crucible, raise the temperature to 1300° C. at a heating rate of 12° C. / min in ...

Embodiment 3

[0038] A high thermal expansion glass powder for copper paste is provided, the components are: BaO 60%, ZnO21.1%, B 2 o 3 8%, Al 2 o 3 4%, CaO 2.5%, Fe 2 o 3 0.5%, SiO 2 1%, SrO 0.5%, SnO 2 0.5%, CoO 0.5%, ZrO 2 0.5%, Bi 2 o 3 0.9%.

[0039] The preparation method of high thermal expansion glass powder for above-mentioned copper paste specifically comprises the following steps:

[0040] 1) According to the distribution ratio of each oxide component in the above-mentioned glass powder, weigh 77.3g of BaCO with an electronic balance 3 , 21.1g ZnO, 14.2g H 3 BO 3 , 7g Al 2 o 3 , 4.5g CaCO 3 , 0.5g Fe 2 o 3 , 1g SiO 2 , 0.7g SrCO 3 , 0.8g Sn(CO 3 ) 2 , 0.5g CoO, 0.5g ZrO 2 , 0.9g Bi 2 o 3 ; Put the weighed raw materials into a ball mill and grind and stir for 10 minutes until they are evenly mixed.

[0041] 2) Put the glass raw materials uniformly mixed in step 1) into an alumina crucible, raise the temperature up to 1350° C. at a rate of 14° C. / min...

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Abstract

The invention discloses high-thermal-expansion glass powder for copper paste as well as a preparation method and application of the high-thermal-expansion glass powder.The high-thermal-expansion glasspowder comprises the following components in percentage by mass: 52-62% of BaO, 19-25% of ZnO, 8-10% of B2O3, 4-8% of Al2O3, 2.5-5% of CaO, 0.1-3% of Fe2O3, 1-3% of SiO2, 0.1-3% of SrO, 0.1-5% of SnO2,0.1-3% of CoO, 0.1-3% of ZrO2 and 0.5-1% of Bi2O3. The preparation method comprises the following steps of: uniformly mixing the raw materials to obtain a glass batch; melting the glass batch, flattening the molten glass batch on a mold; naturally cooling the glass batch under an air condition; and performing crushing, ball-milling and sieving to obtain the high-thermal-expansion glass powder for the copper paste. The glass powder has the advantages of low sintering temperature, high thermal expansion coefficient, favorable dielectric constant, simple preparation method and cheap and accessible raw materials, and can be used for sealing magnesium oxide ceramic substrates.

Description

technical field [0001] The invention relates to the technical field of conductive fillers, in particular to a high thermal expansion glass powder for copper paste and its preparation method and application. Background technique [0002] With the development of the electronics industry, high-quality, high-efficiency electronic components are becoming more and more important. As a sealing material for the manufacture of electronic components, electronic paste has important applications in many aspects, including the manufacture of capacitors, integrated circuits, resistors, sensitive components and so on. The main application fields of these electronic components are military, mobile phones, computers, digital home appliances and other electronic products. Therefore, in the electronic information industry, the demand for electronic paste is increasing, and the requirements are getting higher and higher. According to the conductive phase, the electronic paste is mainly divide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C12/00C03C3/066C04B37/00
CPCC03C12/00C03C3/066C04B37/003
Inventor 何峰闫东阳张兵杨虎谢峻林
Owner WUHAN UNIV OF TECH
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