Material cleaning method for machining of semiconductor chip grinding equipment rack

Abstract

The invention discloses a material cleaning method for machining of a semiconductor chip grinding equipment rack. The material cleaning method comprises the following steps that S1, cleaning recordingis conducted, specifically, a cleaning recording database is established; S2, cleaning preparation is conducted, specifically, a material cleaning product is prepared, and a material for machining ofthe semiconductor chip grinding equipment rack is placed; and S3, primary cleaning is conducted, specifically, the material for machining of the semiconductor chip grinding equipment rack is placed in an ultrasonic cleaner, the cleaning time is set, the cleaning temperature is set, cleaning liquid is added, and the cleaning frequency is recorded. In conducting of the material cleaning method, thematerial for machining of the semiconductor chip grinding equipment rack is pre-cleaned for the first time through primary cleaning, meanwhile, bromopropane and the machined material are in soaking type contact through soaking after drying, thus the bromopropane can wrap the machined material, and deep cleaning is achieved; and deep cleaning is conducted through secondary cleaning after soaking is completed, the cleaning efficiency of the machined material is improved, and using by workers is facilitated.

Description

technical field [0001] The invention relates to the technical field of material cleaning, in particular to a material cleaning method for semiconductor chip grinding equipment frame processing. Background technique [0002] In the semiconductor chip manufacturing process, after entering the deep sub-micron semiconductor step, most semiconductor manufacturers will use the grinding step with better planarization effect to uniformly remove the target thin film layer with irregular surface on the semiconductor chip. After the grinding step, it can have a flat and regular surface to achieve a comprehensive planarization of the semiconductor surface to ensure the yield of the subsequent steps. During the processing of the semiconductor chip grinding equipment rack, the materials processed by the rack need to be cleaned, and During the cleaning process of the processing material of the rack, the surface of the processing material is coated with a special coating, and heat is releas...

AI Technical Summary

Problems solved by technology

[0003] Among the existing cleaning methods for the processing materials of semiconductor chip grinding equipment racks, most of them use manual wiping or ultrasonic cleaning, but the existing cleaning methods are not complete enough to clean the processing materials of semiconductor chip grinding equipment racks, and cannot be cleaned. Deep cleaning, for this purpose, a material cleaning method for semiconductor chip grinding equipment rack processing is proposed

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