A high-impact class A non-combustible high-pressure decorative board and its preparation method
A high-impact, decorative board technology, applied in the field of decorative materials, can solve the problems of reducing thermal shrinkage stress of melamine-formaldehyde resin decorative coatings, affecting decorative effects, and yellowing of phenolic resins.
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Embodiment 1
[0035] Composite the decorative layer, buffer layer, inorganic plate, buffer layer, and decorative layer in order from top to bottom. The thickness of the decorative layer from top to bottom is 0.06mm, the thickness of the buffer layer is 0.04mm, and the thickness of the inorganic plate is 4mm. The thickness of the buffer layer is 0.04mm, the thickness of the decorative layer is 0.06mm, and then placed in a multi-layer high-pressure press for compression molding, the unit pressure is 6.5MPa, the heating time of the hot press is 15min, the pressure holding time is 35min, and the pressure holding cooling time After 30 minutes, the plate core temperature reaches 135°C and is cooled to form. After the plate core temperature drops below 50°C, the pressure is released and the machine is unloaded. After the slab is sawed, a high-impact A-grade non-combustible high-pressure decorative plate is obtained.
Embodiment 2
[0037] Composite the decorative layer, buffer layer, inorganic plate, buffer layer, and decorative layer in order from top to bottom. The thickness of the decorative layer from top to bottom is 0.2mm, the thickness of the buffer layer is 0.3mm, and the thickness of the inorganic plate is 25mm. The thickness of the buffer layer is 0.3mm, the thickness of the decorative layer is 0.2mm, and then placed in a multi-layer high-pressure press for compression molding, the unit pressure is 8MPa, the heating time of the hot press is 20min, the pressure holding time is 40min, and the pressure holding cooling time is 45min , the plate core temperature reaches 135°C and is cooled to form. After the plate core temperature drops below 50°C, the pressure is released and the machine is unloaded.
Embodiment 3
[0039]Composite the decorative layer, buffer layer, inorganic plate, buffer layer, and decorative layer in order from top to bottom. The thickness of the decorative layer from top to bottom is 0.1mm, the thickness of the buffer layer is 0.2mm, and the thickness of the inorganic plate is 8mm. The thickness of the buffer layer is 0.2mm, the thickness of the decorative layer is 0.15mm, and then placed in a multi-layer high-pressure press for compression molding, the unit pressure is 10MPa, the heating time of the hot press is 17min, the pressure holding time is 38min, and the pressure holding cooling time is 40min , the plate core temperature reaches 135°C and is cooled to form. After the plate core temperature drops below 50°C, the pressure is released and the machine is unloaded.
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