Waveform data processing method for frequency measurement test of SC cut type quartz wafer online grinding
A quartz wafer and frequency measurement technology, which is applied in the direction of measuring devices, measuring electrical variables, frequency measuring devices, etc., can solve problems such as low repeatability, wrong frequency judgment, unstable shutdown frequency, etc., to achieve accurate data and perfect processing process Effect
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Embodiment 1
[0059] like Figures 1 to 6 As shown, a waveform data processing method for frequency measurement test of SC-cut quartz wafer online grinding, including single frequency sweep double resonance frequency waveform matching function, single frequency sweep resonance frequency data processing function, and data processing function per unit time ; It specifically provides a frequency measurement test method in a grinding machine. When the quartz wafer is in the grinding machine, the user can manually set the frequency sweep parameters and frequency measurement parameters, and realize the measurement of the dual resonance frequency of the quartz wafer in the grinding machine through the frequency measurement test function, and count the measured resonance frequency per unit time. Number of times, statistics of B-mode and C-mode resonant linewidth, sweep frequency amplitude, standard deviation, etc. Users can use these information to judge whether the resonance waveform is normal, a...
Embodiment 2
[0118] Such as Figure 1 to Figure 17 As shown, the SC-cut quartz wafer online grinding frequency measurement system has the following functions:
[0119] 1. During the grinding process, it can automatically search for the B-mode frequency and C-mode frequency of the quartz wafer, and confirm whether the searched frequency is the B-mode frequency or the C-mode frequency according to the proportional relationship.
[0120] 2. During the tracking frequency measurement process, it can track the B-mode frequency and C-mode frequency in real time, and provide corresponding statistics in real time, such as the number of quartz wafers measured in one circle, the dispersion of a single chip, the dispersion of the whole disk, and the grinding rate, etc. information, and simultaneously display the change curve of the resonant frequency of the wafer and the change curve of the dispersion difference during the grinding process, and the user can judge the incoming material of the wafer and...
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