Organic coating anti-corrosion bonding silver wire and preparation method thereof
A bonding wire and bonding technology, which is used in semiconductor/solid-state device manufacturing, coatings, circuits, etc., can solve the problems of increasing the electroplating metal protective layer process, increasing the cost of bonding silver wires, and being unable to be widely used. The effect of reduced corrosion impurities, lower production and storage costs, and shorter time
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Embodiment 1
[0021] This embodiment provides a specific implementation of an organic coated anti-corrosion bonding silver wire, as follows:
[0022] (1) Prepare organic coating solution: 2-methylthioaniline is dissolved in 50% ethanol solution, the consumption ratio of 2-methylthioaniline and 50% ethanol solution is 1.5g:100ml, and the dissolution temperature is 35 °C, stir to dissolve.
[0023] (2) Dilute the organic coating solution: dilute the organic coating solution prepared in step (1) with deionized water at a volume ratio of 1:5, and stir evenly.
[0024] (3) Pre-cleaning the bonding wire: wash the bonding silver wire with a diameter of 23um in water, air-dry and heat-dry, and this process is controlled within 10s. The content of the bonding silver wire is 99.9wt% silver, and the rest are trace metal elements.
[0025] (4) Organic coating: the bonded silver wire cleaned in step (3) is passed through a horizontal dipping coating tank, and the horizontal dipping coating tank is fil...
Embodiment 2
[0028] This embodiment provides a specific implementation of an organic coated anti-corrosion bonding silver wire, as follows:
[0029] (1) Preparation of organic coating solution: 2-methylthioaniline is dissolved in 50% ethanol solution, the dosage ratio of 2-methylthioaniline and 50% ethanol solution is 1.0g:100ml, and the dissolution temperature is 40 °C, stir to dissolve.
[0030] (2) Dilute the organic coating solution: dilute the organic coating solution prepared in step (1) with deionized water at a volume ratio of 1:20, and stir evenly.
[0031] (3) Pre-cleaning the bonding wire: wash the bonding silver wire with a diameter of 20um, and dry it in air and heat. This process is controlled within 5s. The content of the bonding silver wire is 99.9wt% silver, and the rest are trace metal elements.
[0032] (4) Organic coating: the bonded silver wire cleaned in step (3) is passed through a horizontal dipping coating tank, and the horizontal dipping coating tank is filled w...
experiment example 1
[0039] Experimental example 1 high temperature vulcanization discoloration test
[0040] Test method: Put 6g of sulfur powder into a flask with a volume of 2.5L, put them into the bonded silver wires described in Examples 1-2 and Comparative Example 1 respectively, and carry out the high-temperature vulcanization discoloration test, test at a constant temperature of 80°C, and place them separately After 15min, 30min, 60min and 120min, take it out and observe the discoloration of the bonded silver wire.
[0041] Table 1 embodiment 1-2, comparative example 1 gained bonded silver wire high temperature vulcanization discoloration test result
[0042] Discoloration 0min 15min 30min 60min 120min Example 1 silver white yellow yellow gray grey gray black Example 2 silver white yellow white yellow gray grey gray black Comparative example 1 silver white yellow gray grey dark gray gray black
[0043] Note: As the degre...
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Abstract
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