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A method for the controllable growth of two-dimensional semiconductor thin films by supercritical carbon dioxide pulses

A two-dimensional semiconductor and carbon dioxide technology, applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of slow deposition rate and difficulty in reaching mass production level, and achieve reduced preparation costs and precise film thickness , the effect of less environmental pollution

Active Publication Date: 2021-09-24
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with the CVD method, its deposition rate is too slow to reach the mass production level; since the control of the atomic layer comes from the self-limiting effect under low temperature conditions, it leads to limitations in the selection of precursors

Method used

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  • A method for the controllable growth of two-dimensional semiconductor thin films by supercritical carbon dioxide pulses
  • A method for the controllable growth of two-dimensional semiconductor thin films by supercritical carbon dioxide pulses
  • A method for the controllable growth of two-dimensional semiconductor thin films by supercritical carbon dioxide pulses

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0044] Weigh 50mg molybdenum hexacarbonyl (Mo(CO) 6 ) is the metal precursor placed in the precursor dissolution tank; the temperature is 40 ℃, the pressure is 15MPa supercritical carbon dioxide dissolved; 1 × 1cm 2 SiO 2 The / Si carrier is placed in the pressure relief nucleation and reaction zone; the dissolved Mo(CO) 6 The supercritical carbon dioxide mixture enters the pressure relief nucleation and reaction zone with a flow rate of 150sccm and a pulse time of 30s; inject supercritical carbon dioxide into the pressure relief nucleation and reaction zone, keep the temperature at 50°C and the pressure at 20MPa for 1min; Open the bypass to quickly reduce the pressure relief nucleation and reaction zone pressure from 20MPa to 0MPa; after the carrier is locally heated to 155°C, the Mo(CO) will be dissolved 6 The supercritical carbon dioxide mixture enters the pressure relief nucleation and reaction zone with a flow rate of 75sccm and a pulse time of 30s; the pressure relief n...

example 2

[0046] Weigh 50mgMo(CO) 6 For the metal precursor with 10g C 2 h 6 S 2 The non-metallic precursor is placed in two precursor dissolution tanks respectively; the supercritical carbon dioxide with a temperature of 40 ° C and a pressure of 20 MPa is introduced to dissolve; 1 × 1 cm 2 SiO 2 The / Si carrier is placed in the pressure relief nucleation and reaction zone; the dissolved Mo(CO) 6 The supercritical carbon dioxide mixture enters the pressure relief nucleation and reaction zone with a flow rate of 150sccm and a pulse time of 30s; inject supercritical carbon dioxide into the pressure relief nucleation and reaction zone, keep the temperature at 50°C and the pressure at 40MPa for 1.5min; open within 80s Quickly open the bypass to quickly reduce the pressure relief nucleation and reaction zone pressure from 40MPa to 0MPa; after the carrier is locally heated to 175°C, the Mo(CO) will be dissolved 6 The supercritical carbon dioxide mixture enters the pressure relief nucleati...

example 3

[0048] Weigh 60mg tungsten hexacarbonyl (W(CO) 6 ) is the metal precursor placed in the precursor dissolution tank; the temperature is 50 ℃, the pressure is 35MPa supercritical carbon dioxide dissolved; 1 × 1cm 2 al 2 o 3 The carrier is placed in the pressure release nucleation and reaction zone; the dissolved W(CO) 6 The supercritical carbon dioxide mixture enters the pressure relief nucleation and reaction zone with a flow rate of 125sccm and a pulse time of 30s; inject supercritical carbon dioxide into the pressure relief nucleation and reaction zone, keep the temperature at 50°C and the pressure at 60MPa for 1min; open the fast valve within 90s Open the bypass to quickly reduce the pressure relief nucleation and reaction zone pressure from 60MPa to 0MPa; after the carrier is locally heated to 200°C, the dissolved W(CO) 6 The supercritical carbon dioxide mixture enters the pressure relief nucleation and reaction zone with a flow rate of 50sccm and a pulse time of 30s; th...

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Abstract

The invention relates to a method for the controllable growth of two-dimensional semiconductor thin films by supercritical carbon dioxide pulses, which belongs to the field of preparation of nanocomposite thin films. The method of the present invention uses supercritical carbon dioxide as a transport medium to increase the concentration of the precursor, reduce the growth temperature, and reduce environmental pollution; precisely regulate the flow of the precursor through the pulse control area, reduce the amount of the precursor, and reduce the preparation cost; use rapid pressure relief The formation of seed crystals is beneficial to the growth of two-dimensional semiconductor films and improves the growth efficiency; selecting different precursors and suitable carriers can achieve the purpose of preparing heterogeneous composite films; it can solve the problem of high reaction temperature, uncontrollable film quality and ALD in CVD methods. The problem of low film forming efficiency.

Description

technical field [0001] The invention relates to the field of preparation of nanocomposite thin films, in particular to a method for growing a two-dimensional semiconductor thin film with supercritical carbon dioxide pulse controllable. [0002] technical background [0003] As a branch of nanomaterials, two-dimensional semiconductor thin films have adjustable bandgap, good stability, high carrier mobility and switching ratio due to their precise preparation on the atomic scale. They are widely used in integrated circuits and optoelectronic devices. It has great application prospect. Therefore, the development of two-dimensional semiconductor thin films has become the focus of scientific research and industry. [0004] High-quality two-dimensional semiconductor thin films are mostly prepared by chemical vapor deposition (CVD). The traditional CVD technology is mature and the deposition rate is fast, but there is a contradiction: the substrate material often cannot withstand ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/455C23C16/30C23C16/26C23C16/52C23C16/18
CPCC23C16/18C23C16/26C23C16/305C23C16/45523C23C16/52
Inventor 徐琴琴王启搏银建中柳宝林王志刚
Owner DALIAN UNIV OF TECH