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Forming method of SiCp/Al composite material

A composite material and forming method technology, applied in the field of powder metallurgy materials, can solve the problems of low production efficiency, high process cost, high labor cost, etc., and achieve the effects of short hot pressing time, improved feasibility and extended life

Active Publication Date: 2021-01-08
陕西冶焰绿陶新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a forming method of SiCp / Al composite material, to solve the problems of low production efficiency, high process cost and high labor cost of the existing SiCp / Al composite material preparation method

Method used

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  • Forming method of SiCp/Al composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0051] Step 1) SiC selects abrasive-grade green silicon carbide powder with a particle diameter of 63 μm;

[0052] Al selects industrial pure aluminum powder, and Al50Mg powder is a commercially available alloy powder with a particle size of 100 μm. These two powders are prepared into a mixed powder whose nominal composition is Al10Mg;

[0053] Then SiC particles and Al10Mg mixed powder are uniformly mixed in a volume ratio of 60%: 40%;

[0054] Step 2) Put the uniformly mixed SiC / Al powder in step 1) into a steel cold press mold, and press and form it into a SiC / Al blank under a press pressure of 100 MPa;

[0055] Step 3) Put the cold-pressed SiC / Al formed in step 2) into a hot-pressing mold made of graphite under atmospheric pressure conditions, and perform hot-pressing sintering by using rapid heating and hot-pressing technology. Among them, the sintering process of the rapid heating and hot pressing technology is: the heating temperature is 600°C, the applied pressure is ...

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Abstract

The invention discloses a forming method of a SiCp / Al composite material. The forming method comprises the following steps that 1) powder mixing is conducted, specifically, SiC particles and Al powderor Al alloy powder are evenly mixed according to the volume ratio of (10-90%): (90-10%) to obtain SiC / Al powder, the diameter of the SiC particles is 14-63 microns, and the particle size of the Al powder or the Al alloy powder is 50-150 microms; 2) cold pressing forming is conducted, specifically, the SiC / Al powder obtained through even mixing in the step 1) is put into a steel mold, and a SiC / Alblank is formed through pressurization under the stress of 50-200MPa; and 3) hot pressing sintering is conducted, specifically, under the atmospheric pressure condition, the SiC / Al blank formed through cold pressing in the step 2) is put into a hot pressing mold, hot pressing is conducted on the SiC / Al blank through a press machine and a rapid heater, and the SiCp / Al composite material is obtained after hot pressing is completed. The problems that an existing preparation method of the SiCp / Al composite material is low in production efficiency, high in process cost and high in labor cost are solved.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy materials, and in particular relates to a forming method of SiCp / Al composite material. Background technique [0002] With the continuous development of modern science and technology, higher and higher requirements are put forward for the performance of materials. At present, it is difficult for a single engineering material commonly used to meet the actual needs of engineering. The compounding of materials with different characteristics is an important way to solve this problem. The way, that is, composite materials have gradually become irreplaceable new materials in the engineering field, such as large-scale integrated circuit substrates and high-power LED lamp substrates. The latter currently mainly uses alumina or copper or aluminum substrates. Ceramic substrates have thermal expansion properties equivalent to those of semiconductor chip materials, but their thermal properties of lo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C21/00C22C29/06C22C32/00
CPCC22C1/05C22C1/051C22C21/00C22C29/065C22C29/067C22C32/0063
Inventor 张文兴许军锋王鑫王喜锋李高宏
Owner 陕西冶焰绿陶新材料有限公司
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