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Test structure, wafer and manufacturing process control monitoring method forwafer

A technology for testing structure and manufacturing process, which is applied to the photoengraving process of the pattern surface, the exposure device of the photoengraving process, the testing/measurement of semiconductor/solid-state devices, etc. Effect

Active Publication Date: 2021-01-08
WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the field of photonic integrated chips or optoelectronic integrated chips, waveguides are more sensitive to the manufacturing process of photonic integrated chips or optoelectronic integrated chips. or PCM for optoelectronic integrated chip manufacturing process

Method used

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  • Test structure, wafer and manufacturing process control monitoring method forwafer
  • Test structure, wafer and manufacturing process control monitoring method forwafer
  • Test structure, wafer and manufacturing process control monitoring method forwafer

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Embodiment Construction

[0026] It should be noted that, in the case of no conflict, the embodiments in the application and the technical features in the embodiments can be combined with each other. Undue Limitation of This Application. Among them, nm is the SI unit of nanometer, and dB is the SI unit of decibel. The present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] See figure 1 , the embodiment of the present application provides a test structure for wafer manufacturing process control monitoring, the test structure 100 includes at least one test unit 10, the test unit 10 includes an input coupler 11, a waveguide 12 and an output coupler 13, the waveguide 12 , the input coupler 11 and the output coupler 13 are all formed through a manufacturing process; polarized light of different wavelengths is injected into the input coupler 11 , transmitted through the waveguide 12 , and then emitted from the output cou...

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PUM

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Abstract

The embodiment of the invention provides a test structure, a wafer and a manufacturing process control monitoring method for a wafer. The test structure comprises at least one test unit, the test unitcomprises an input coupler, a waveguide and an output coupler; the waveguide, the input coupler and the output coupler are formed through a manufacturing process; polarized light with different wavelengths enters the input coupler, is transmitted through the waveguide and then is emitted out from the output coupler. Whether a mask plate is aligned in the exposure process and whether the etching depth in the etching process meets the requirements or not are determined by acquiring spectral characteristic curves of the polarized light with different wavelengths, so that the consistency and stability of the manufacturing process are ensured, the control and monitoring of the manufacturing process of the wafer are realized, and the yield of a photon integrated chip or a photoelectron integrated chip is improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor integration, and in particular to a test structure, a wafer, and a manufacturing process control and monitoring method for the wafer. Background technique [0002] In the microelectronic integrated chip process, the process factory usually designs a Process Control Monitor (PCM, Process Control Monitor) for the monitoring and control of the manufacturing process, which is used to improve the stability of the microelectronic integrated chip manufacturing process and improve the quality of the finished microelectronic integrated chip. Rate. In the field of photonic integrated chips or optoelectronic integrated chips, waveguides are more sensitive to the manufacturing process of photonic integrated chips or optoelectronic integrated chips. Or PCM of optoelectronic integrated chip manufacturing process. Contents of the invention [0003] In view of this, the embodiment of the prese...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/122G02B6/26G02B6/34G03F7/20H01L21/66H01L23/544H01L29/06
CPCG02B6/26G02B6/34G02B6/1228G03F7/7085H01L29/06H01L23/544H01L22/12Y02P90/02
Inventor 冯朋肖希刘敏吴定益
Owner WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
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