A device and method for removing adsorbed nanoscale particles on the surface of a silicon wafer

Abstract

The invention belongs to the related technical field of semiconductor surface cleaning, and discloses a device and method for removing nano-scale particles adsorbed on the surface of a silicon wafer. The device includes a vacuum component and a droplet emission and acceleration component connected to the vacuum component; droplet emission and acceleration The components include liquid storage, graphite electrode, PEEK capillary, fused silica capillary and grounded extraction electrode; the liquid storage is set above the vacuum component, which is used to contain the conductive solution; the graphite electrode is set on the liquid storage, and its two ends are respectively used for contact with The DC power supply is connected and in contact with the conductive liquid; one end of the PEEK capillary is connected with the liquid storage, the other end is connected with the fused silica capillary, and one end of the fused silica capillary extends into the vacuum component; the extraction electrode is arranged in the vacuum component, and It is located opposite the emission tip formed by the fused silica capillary. The invention improves the cleaning efficiency, reduces the cost, and realizes no liquid residue after removal.

Description

technical field [0001] The invention belongs to the technical field related to semiconductor surface cleaning, and more specifically relates to a device and method for removing adsorbed nanoscale particles on the surface of a silicon wafer. Background technique [0002] The integrated circuit industry reflects the level of a country's high-end manufacturing industry. The current emerging industries such as cloud computing, Internet of Things, and big data have greatly promoted the demand for integrated circuit chips. For example, China imports about 200 billion US dollars of chips every year, which has exceeded its oil imports. It is the largest chip consumption market in the world, and only 16% of them are localized. The integrated circuit industry is related to national security and is still a weak link in the manufacturing industry. The bottleneck technology surrounding the integrated circuit industry has become a problem that scientific researchers urgently need to overc...

AI Technical Summary

Problems solved by technology

At present, the main technology of pollution particle removal research is fluid removal technology. Its principle is to use fluid to impact pollution particles to generate removal force, and then realize the removal of pollution particles, such as high-pressure liquid jet flow, high-pressure gas jet flow, etc., but the fluid accelerated by high pressure The speed can only reach hundreds of meters per second, and it is difficult to remove particles with small particle sizes, especially the single droplet produced by high-pressure liquid jets is relatively large, which will damage the structure of the device and cause secondary pollution due to residual liquid

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