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Bionic 3D printing aerogel thermal insulation board and preparation method thereof

A technology of thermal insulation board and 3D printing, which is used in thermal insulation, additive processing, climate change adaptation, etc. It can solve the problems of thermal insulation performance and unsatisfactory bulk density of thermal insulation board, and achieve the optimization of lightweight thermal insulation performance, reduction of heat loss, The effect of fast printing

Active Publication Date: 2021-01-29
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing thermal insulation boards are still not ideal in terms of thermal insulation performance and bulk density.

Method used

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  • Bionic 3D printing aerogel thermal insulation board and preparation method thereof
  • Bionic 3D printing aerogel thermal insulation board and preparation method thereof
  • Bionic 3D printing aerogel thermal insulation board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A method for manufacturing bionic 3D printed airgel insulation boards, the preparation flow chart is as follows image 3 shown, including the following steps:

[0047] (1) Weigh 20.83g tetraethyl orthosilicate, 46.07g ethanol and 18.02g deionized water (the molar ratio of tetraethyl orthosilicate to ethanol and ionized water is 1:10:10), add 1.0415g polydimethyl Siloxane (mass ratio of ethyl orthosilicate to polydimethylsiloxane: 1:0.05), use 10% dilute hydrochloric acid to adjust the pH value of the system to 2, hydrolyze at 25°C for 24h to obtain SiO 2 Colloidal solution;

[0048] (2) The molar ratio of ammonia water to tetraethyl orthosilicate is 0.003:1, and the ammonia water is diluted to SiO 2 equal volume of colloidal solution, the SiO 2 The colloidal solution and dilute ammonia water are transported to the three-way pipe through two hoses through a peristaltic pump and mixed to obtain SiO 2 Precursor sol, the pH value of the mixed system is 6.3, SiO 2 The g...

Embodiment 2

[0055] A method for manufacturing bionic 3D printed airgel insulation panels, comprising the following steps:

[0056] (1) Weigh 20.83g tetraethyl orthosilicate, 23.04g ethanol and 27.03g deionized water (the molar ratio of tetraethyl orthosilicate to ethanol and ionized water is 1:5:15), add 0.8332g polydimethyl Siloxane (mass ratio of ethyl orthosilicate to polydimethylsiloxane 1:0.04), adjust the pH of the system to 2 with 10% dilute hydrochloric acid, and hydrolyze it at 25°C for 24h to obtain SiO 2 Colloidal solution;

[0057] (2) The molar ratio of ammonia water to tetraethyl orthosilicate is 4×10 -3 , dilute ammonia to SiO 2 Equal volume of colloidal solution, SiO 2 The colloidal solution and dilute ammonia water are transported to the three-way pipe through two hoses through a peristaltic pump and mixed to obtain SiO 2 Precursor sol, the pH value of the mixed system is 6.6, SiO 2 The gel time of the precursor sol is 10-15min;

[0058] (3) Prepare the supporting s...

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Abstract

The invention relates to a bionic 3D printing aerogel thermal insulation board and a preparation method thereof. The bionic 3D printing aerogel thermal insulation board is composed of a supporting shell of an extremely-small curved surface structure and SiO2 aerogel evenly distributed in curved surface gaps of the supporting shell. The structure of the bionic 3D printing aerogel thermal insulationboard is designed by adopting a bionic minimum curved surface model, an easily-formed extrudable gypsum-based cementing material and SiO2 aerogel with an extremely low heat conductivity coefficient are selected as raw materials, the thermal insulation board with low apparent density is printed by using a 3D printing technology, and on the basis of ensuring the strength, the zigzag hole wall structure of the board greatly reduces the heat loss of the board in the thickness direction, and the filler SiO2 aerogel has extremely low heat conductivity coefficient and can also reduce the heat loss.

Description

technical field [0001] The invention belongs to the technical field of building materials, and in particular relates to a bionic 3D printed airgel insulation board and a preparation method thereof. Background technique [0002] In recent years, my country's building energy consumption has continued to grow, of which heating and cooling account for a large proportion. In order to achieve low thermal conductivity and high thermal resistance to achieve the purpose of thermal insulation, insulation boards are usually used as building exterior walls at this stage. The thermal conductivity of insulation boards is relatively low, which can effectively improve the comfort of the building interior by reducing heat absorption and heat dissipation. , reduce the frequency of heating and air conditioning, so that the energy consumption of the building is reduced, and the insulation board can be prefabricated in the factory in advance and then directly used for building installation, no a...

Claims

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Application Information

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IPC IPC(8): C04B28/14E04B1/80B33Y70/10
CPCC04B28/14E04B1/80B33Y70/10C04B2111/00181C04B2201/20C04B2201/32C04B2201/50C04B24/383C04B24/14C04B14/102C04B2103/302Y02B80/10
Inventor 黄健赵雨婷江奇王新杨正才段斌
Owner WUHAN UNIV OF TECH
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